Aqueous solder paste cleaning agent for printed circuit board and preparation method for aqueous solder paste cleaning agent

Abstract

The invention discloses an aqueous solder paste cleaning agent for a printed circuit board. The cleaning agent is prepared from the following raw materials in parts by weight: 3 to 4 parts of fatty alcohol-polyoxyethylene ether, 3 to 4 parts of sodium isopropyl benzene sulfonate, 5 to 6 parts of coconut diethanolamide, 40 to 50 parts of ethanol, 3 to 5 parts of tween 80, 4 to 5 parts of lauryl alcohol, 2 to 3 parts of disodium malate, 2 to 3 parts of acetic acid, 4 to 5 parts of auxiliaries and 100 to 120 parts of de-ionized water. The cleaning agent is high in compatibilization performance, antistatic, anticorrosive, low in loss and high in printing quality, and has a good pH value buffer effect and a remarkable surfactant compounding effect, residual solder paste, a residual adhesive and a solvent can be quickly removed from the printed circuit board, the cost is lowered, time is saved, the reject ratio can be greatly decreased, and a plurality of printed circuit boards with high quality can be quickly manufactured; the auxiliaries can form a protective film on the surface of the printed circuit board to isolate air, prevent the printed circuit board from being corroded by water and other molecules in the atmosphere and prevent oxidation, so that convenience is brought to the next manufacturing process.

Description

technical field [0001] The invention relates to the field of cleaning agents, in particular to a water-based printed circuit board solder paste cleaning agent and a preparation method thereof. Background technique [0002] With the rapid development of integrated circuits, the volume of circuit boards is getting smaller and smaller, and electronic components are getting smaller and denser. If the dirt and dust inside are not cleaned during the production process, it may cause problems such as short circuit and corrosion, which will affect the normal operation of the circuit board. At present, most circuit board cleaners are made of organic substances, which have good cleaning effect and are not easy to cause problems such as short circuit and corrosion. However, organic compounds are not only expensive, but also pollute the environment, destroy the ozone layer, and are harmful to human health. There are also a few water-based cleaning agents, but the cleaning effect is limi...

AI Technical Summary

Problems solved by technology

If the dirt and dust inside are not cleaned during the production process, it may cause problems such as short circuit and corrosion, which will affect the normal operation of the circuit board

At present, most circuit board cleaners are made of organic substances, which have good cleaning effect and are not easy to cause problems such as short circuit and corrosion. However, organic compounds are not only costly, but also pollute the environment, destroy the ozone layer, and are harmful to human health.

There are also a few water-based cleaning agents, but the cleaning effect is limited, and there are safety risks. Further improvement of the formula and process is required to achieve the goals of thorough cleaning, no pollution, little corrosion, health, circuit safety, and cost reduction