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Environment-friendly de-plating liquid of copper plating layer and de-plating process of reproducible de-plating liquid

A stripping solution and environment-friendly technology, applied in the field of stripping solution and stripping process, can solve the problems of equipment and workshop corrosion, serious environmental pollution, over-corrosion of the substrate, etc., and achieve stable stripping solution, high efficiency and stable reaction. Effect

Inactive Publication Date: 2014-02-12
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional deplating process, the deplating solution containing high concentration of sulfuric acid and nitric acid is usually used. The above deplating solution contains a strong oxidant and has strong acidity, so it is very easy to have an adverse effect on the substrate itself during deplating.
In addition, the reaction between concentrated nitric acid and copper is not only a strong oxidant, but also an acid, which produces a large amount of harmful NOX gas, commonly known as "Huanglong". Corrosion

Method used

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  • Environment-friendly de-plating liquid of copper plating layer and de-plating process of reproducible de-plating liquid
  • Environment-friendly de-plating liquid of copper plating layer and de-plating process of reproducible de-plating liquid
  • Environment-friendly de-plating liquid of copper plating layer and de-plating process of reproducible de-plating liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Coating thickness: 25μm-30μm;

[0051] Coating size: 4cm×5cm;

[0052] Prepare 350mL deplating solution, the components of the deplating solution are as follows:

[0053]

[0054] Deplating conditions: temperature 35°C-40°C; mechanical stirring; each stripping 0.2dm 2 Add 20mL of hydrogen peroxide (30%) to the coating.

[0055] Deplating time: 4min-15min.

[0056] Deplating solution regeneration: complete 2dm 2 After deplating of the area coating, the regeneration of the deplating solution is carried out, and the regeneration conditions are:

[0057] 1. Add excess manganese dioxide, filter, and concentrate the filtrate by electrodialysis to the same volume as the original deplating solution.

[0058] 2. The ruthenium-titanium oxide-coated DSA anode with a 2mm-thick mesh structure has an effective size of 6cm×6cm, and the stainless steel substrate is the cathode with an effective size of 6cm×6cm. The current density is 2A / dm 2 Under electrolysis for 34 minutes, ...

Embodiment 2

[0061] Coating thickness: 25μm-30μm;

[0062] Coating size: 4cm×5cm;

[0063] Prepare 350mL deplating solution, the components of the deplating solution are as follows:

[0064]

[0065] Deplating conditions: temperature 35°C-40°C; mechanical stirring; each stripping 0.2dm 2 Add 24mL of hydrogen peroxide (30%) to the coating.

[0066] Deplating time: 3min-14min.

[0067] Deplating solution regeneration: with embodiment one

Embodiment 3

[0069] Coating thickness: 25μm-30μm;

[0070] Coating size: 4cm×5cm;

[0071] Prepare 350mL deplating solution, the components of the deplating solution are as follows:

[0072]

[0073]

[0074] Deplating conditions: temperature 35°C-40°C; mechanical stirring; each stripping 0.2dm 2 Add 12mL of hydrogen peroxide (30%) to the coating.

[0075] Deplating time: 3min-18min.

[0076] Deplating solution regeneration: with embodiment one.

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Abstract

The invention relates to the technical field of electroplating, and particularly relates to a de-plating liquid and a de-plating process. The environment-friendly de-plating liquid of the copper plating layer is prepared from the raw materials of the de-plating liquid: potassium pyrophosphate, sodium potassium tartrate tetrahydrate, ammonium citrate, disodium hydrogen phosphate, 25% ammonia water and 30% hydrogen peroxide. According to the de-plating process of the reproducible de-plating liquid, copper in the de-plating liquid is recovered by electro-deposition, so that copper ions in the de-plating liquid are reduced, and the de-plating liquid is reproduced and can be recycled by appropriately supplementing hydrogen peroxide. By adopting the technical scheme, compared with the prior art, the de-plating liquid provided by the invention is stable, free from corrosion to the surface of a plate matrix, free from harmful gases, reproducible and recyclable, long in service period and cost-saving, and satisfies the purpose of environment-friendliness and conservation with more social demands.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a deplating solution and a deplating process. Background technique [0002] Unqualified coatings will be produced during the electroplating process, and coatings will also be deposited on the racks supporting the plated parts; the former needs to be recycled, and the latter needs to be used repeatedly, so the coating needs to be completely removed. The stripping solution is usually suitable for the stripping of the copper plating layer on the surface of the substrate. In the traditional deplating process, the deplating solution containing high concentration of sulfuric acid and nitric acid is usually used. The above deplating solution contains a strong oxidant and has strong acidity, so it is very easy to have an adverse effect on the substrate itself during deplating. . In addition, concentrated nitric acid reacts with copper, which is both a strong oxidant and an acid,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C23F1/46
Inventor 张全生郭东莉夏骥王传荟杨楷楷
Owner SHANGHAI INST OF TECH
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