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Light-curing thermal-curing resin composition

A heat-curing resin and light-curing technology, used in optics, optomechanical equipment, instruments, etc.

Active Publication Date: 2014-02-12
SHANGHAI FUSAITE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The surface of the circuit board is provided with a cover film, such as patents CN101747854, CN101378622 and CN102209429 which disclose the cover film and flexible circuit board on the circuit board. The above-mentioned several patents are usually Polyimide film is coated with polyimide resin, epoxy resin, and acrylic resin. However, with the refinement of the circuit, the traditional cover film has processing accuracy problems when punching holes. When pressing the cover film to cover the circuit board, there is a problem of adhesive (glue) seeping out. In short, with the rapid development of the circuit board, the traditional cover film technology can no longer meet the market requirements.

Method used

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  • Light-curing thermal-curing resin composition
  • Light-curing thermal-curing resin composition
  • Light-curing thermal-curing resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0058]In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After uniformity, heat to 90 degrees, and then put into the solution polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 25 grams (0.025 moles), dimethylol propionic acid 5.36 grams (0.04 moles) and γ - 25 grams of butyrolactone, this solution is heated, stirred, and after 5 hours, a uniform transparent viscous polymer liquid is obtained. Then add glycolic acid 5.32 grams (0.07 moles) and gamma-butyrolactone 10 grams in this solution, continue heating at 90 degrees, stir 5 hours, thereby obtain the oligomer of the carbamate of hydroxyacid at the end, The solid content of the urethane oligomer solution is about 55 wt%, and this compound is called resin A.

Synthetic example 2

[0060] In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After uniformity, heat to 90 degrees, and then put into the solution polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 25 grams (0.025 moles), dimethylol propionic acid 5.36 grams (0.04 moles) and γ - 25 grams of butyrolactone, this solution is heated, and after stirring for 5 hours, a uniform transparent viscous polymer liquid is obtained. Then add 10.64 grams (0.07 moles) of p-hydroxyphenylacetic acid and 17 grams of γ-butyrolactone to the solution, continue heating at 90 degrees, and stir for 7 hours to obtain the oligomerization of carbamates whose terminals are hydroxy acids. The solid content of the urethane oligomer solution is about 55 wt%, and this compound is called resin B.

Synthetic example 3

[0062] In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After uniformity, heat to 90 degrees, and then drop into the solution polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 25 grams (0.025 moles), dimethylol propionic acid 2.68 grams (0.02 moles), 1 , 1.8 grams of 4 butanediol (0.02 moles) and 25 grams of gamma-butyrolactone, this solution was heated and stirred for 5 hours to obtain a uniform transparent viscous polymer liquid. Then add glycolic acid 5.32 grams (0.07 moles) and gamma-butyrolactone 9 grams in this solution, continue to heat at 90 degrees, stir for 5 hours, thereby obtain the oligomer of the carbamate of hydroxyacid at the end, The solid content of the urethane oligomer solution is about 55 wt%, and this compound is called resin C.

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Abstract

The invention relates to a light-curing thermal-curing resin composition, and resin film, insulation film and a circuit board which are prepared by the resin composition. The light-curing thermal-curing resin composition comprises (A) a carbamate oligomer the end of which has hydroxy acids, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an acrylic acid monomer and (E) an inorganic filling material. The resin composition has good flexibility, and excellent electrical insulating properties, tin-scolding heat resistance and acid and alkali resistance.

Description

technical field [0001] The present invention relates to the field of materials, in particular to photocurable and / or thermosetting resin compositions used in the manufacture of circuit boards, insulating materials and circuit boards using such materials. [0002] Background technique [0003] In recent years, with the rapid development and progress of semiconductor components, there is a tendency for electronic equipment to be smaller, lighter, more functional, and more multifunctional. In line with these trends, the density of printed circuit boards has continued to increase. A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic signal connection and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027H05K1/02
Inventor 金行洲刘小棣
Owner SHANGHAI FUSAITE NEW MATERIAL