Method for preparing micro-nano needle conical structure for copper interconnection by electrochemical deposition

A copper interconnection and micro-nano technology, which is applied in the cross field of micro-nano and electrochemistry, can solve the problems of expensive production, high process cost, and difficulty in large-scale industrial production, and achieve the effect of low cost and simple process

Active Publication Date: 2014-02-26
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

LIGA technology requires an extremely expensive X-ray light source and a complex mask, making th

Method used

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  • Method for preparing micro-nano needle conical structure for copper interconnection by electrochemical deposition
  • Method for preparing micro-nano needle conical structure for copper interconnection by electrochemical deposition

Examples

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Embodiment 1

[0027] This embodiment relates to a method for preparing a micro-nano needle-cone structure for copper interconnection by electrochemical deposition, and the specific steps are as follows:

[0028] (1) Degrease and derust the copper plate substrate whose surface needs to form a micro-nano needle crystal array structure. The degreasing refers to the removal of organic substances such as oil stains adhering to the surface of the substrate; the derusting refers to the removal of inorganic substances such as the oxide layer on the surface of the substrate.

[0029] (2) Place the base material pre-treated in step (1) in the following electroplating solution, and use the base material as the cathode, and use the copper plate or the insoluble pole plate as the anode, and make the base material, the copper plate (or the insoluble plate) plate) and the electroplating power supply form a loop.

[0030] The electroplating solution used in the present embodiment consists of: copper metha...

Embodiment 2

[0034] This embodiment relates to a method for preparing a micro-nano needle-cone structure for copper interconnection by electrochemical deposition, and the specific steps are as follows:

[0035] (1) Degrease and derust the copper plate substrate whose surface needs to form a micro-nano needle crystal array structure.

[0036] (2) Place the base material pre-treated in step (1) in the following electroplating solution, and use the base material as the cathode, and use the copper plate or the insoluble pole plate as the anode, and make the base material, the copper plate (or the insoluble plate) plate) and the electroplating power supply form a loop.

[0037] The electroplating solution used in this embodiment consists of: copper methanesulfonate 1.5mol / L, copper pyrophosphate 0.5mol / L, ethylenediamine 2mol / L, boric acid 0.3mol / L, additives SPS15ppm, PEG1600ppm, JGB40ppm, solution temperature It is 20°C and the pH value is 5.0.

[0038] (3) Apply direct current to the subst...

Embodiment 3

[0041] This embodiment relates to a method for preparing a micro-nano needle-cone structure for copper interconnection by electrochemical deposition, and the specific steps are as follows:

[0042] (1) Degrease and derust the copper plate substrate whose surface needs to form a micro-nano needle crystal array structure.

[0043] (2) Place the base material pre-treated in step (1) in the following electroplating solution, and use the base material as the cathode, and use the copper plate or the insoluble pole plate as the anode, and make the base material, the copper plate (or the insoluble plate) plate) and the electroplating power supply form a loop.

[0044]The electroplating solution used in this embodiment consists of: copper methanesulfonate 1.5mol / L, copper nitrate 0.25mol / L, ethylenediamine 1mol / L, boric acid 0.3mol / L, additive SPS100ppm, PEG500ppm, JGB1400ppm, solution temperature is 30°C, pH value is 2.5.

[0045] (3) Apply direct current to the substrate through th...

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Abstract

The invention discloses a method for preparing micro-nano needle conical structure for copper interconnection by electrochemical deposition; a conductive base material is used as a cathode and is placed in a electroplating solution containing copper ions, complexing agents and additives, after current is applied, the electrocrystallization grows vertically along one-dimension which is vertical to the surface direction, thereby the micro-nano needle conical structure for copper interconnection is formed on the conductive base material surface; the copper ion is provided by copper methane sulfonate or is mainly provided by copper methane sulfonate, and is supplemented by more than one or two of cupric chloride, copper pyrophosphate and cupric nitrate. The invention provides a preparation method which has the advantages of simple process, low cost without special requirements for substrate shape and material, and is suitable for industrialized batch production of micro-nano needle conical structure for copper interconnection; in addition, according to the preparation method provided by the invention, a copper needle conical crystal structure can be directly formed on the surface of the required base material, and the structure can be used as device and material, thereby providing possibility for realization of industrialized production and wide application.

Description

technical field [0001] The invention relates to a method in the cross-technical fields of micro-nano and electrochemistry, in particular to a method for preparing a micro-nano needle-cone structure for copper interconnection by electrochemical deposition. Background technique [0002] The micro-nano needle-cone crystal array structure refers to a structure that has an ordered array of longitudinal one-dimensional needle-cone crystals on the surface of a substrate (metal or non-metal). This structure has large surface roughness, high surface activity at the nanometer scale, and a special needle-cone array structure, which will produce a variety of new functional properties, and its application prospects are very promising. For example: (1) It is used to improve the bonding strength when copper is combined with other materials, for example, to improve the bonding (interconnection) strength and reliability of low-temperature solid Cu and solder in three-dimensional packaging, a...

Claims

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Application Information

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IPC IPC(8): C25D7/00C25D3/38B82Y40/00
Inventor 邓银屏冯雪李明
Owner SHANGHAI JIAO TONG UNIV
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