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Method for electroless copper plating on glass substrate

A glass substrate and chemical copper plating technology, applied in the field of chemical copper plating on glass, can solve problems such as danger, and achieve the effects of low cost, improved adhesion and good bonding force

Inactive Publication Date: 2014-03-05
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the sputtering method is used, additional large-scale evaporation equipment and metal chromium etching lines are required, and the chromium corrosion solution is highly acidic and oxidizing, which is very dangerous

Method used

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  • Method for electroless copper plating on glass substrate
  • Method for electroless copper plating on glass substrate
  • Method for electroless copper plating on glass substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] figure 1 It is a flow chart of the electroless copper plating method for a glass substrate according to an embodiment of the present invention.

[0043] Step 1: Prepare an organic film solution, dissolve polyimide in N-methylpyrrolidone at a volume ratio of 5%-10% (such as 7%), and stir evenly;

[0044] Step 2: Dip the cleaned and dried substrate into the above-mentioned prepared organic film solution, so that the surface of the substrate is evenly covered with the organic film solution;

[0045] Step 3: Take out the substrate and dry it until the surface is dry, and the organic film is evenly coated on the surface of the substrate; put the glass substrate in a high-temperature oven for 2 hours at 300°C for thermal imidization to form an organic film.

[0046] Step 4: Put the substrate into the chemical copper equipment and perform the conventional electroless copper plating process. The process includes water washing, pre-soaking, activation, water washing, degumming,...

Embodiment 2

[0057] Figure 8 It is a flow chart of the electroless copper plating method for a glass substrate according to an embodiment of the present invention.

[0058] Step 1: Prepare an organic film solution, dissolve polyimide in N-methylpyrrolidone at a volume ratio of 5%, and stir evenly;

[0059] Step 2: Immerse the cleaned and dried glass substrate with through holes in the above-mentioned prepared organic film solution, so that the surface of the glass substrate and the inside of the hole are evenly covered with the organic film solution;

[0060] Step 3: Take out the substrate and dry it until the surface is dry, and the organic film is evenly coated on the surface of the substrate; put the glass substrate in a high-temperature oven for 2 hours at 300°C for thermal imidization to form an organic film.

[0061] Step 4: Put the substrate into the chemical copper equipment and perform the conventional electroless copper plating process. The process includes water washing, pre-s...

Embodiment 3

[0073] Figure 17 to Figure 21 Disclosed is a method for preparing a metal copper circuit layer on a glass substrate.

[0074] Step 1, preparing an organic thin film solution, dissolving polyimide in N-methylpyrrolidone at a volume ratio of 5%, stirring evenly, cleaning the substrate and blowing it dry, such as Figure 9 shown;

[0075] Step 2, immerse the glass substrate 101 with through holes into the above-mentioned prepared organic thin film solution, so that the surface of the substrate and the inside of the hole are evenly covered with the organic thin film solution, take out the substrate, dry the surface until the surface is dry, and put the glass substrate in a high temperature Heat imidization in an oven at 300°C for 2 hours to form an organic film. The organic thin film 102 is evenly coated on the surface of the substrate, such as Figure 10 ;

[0076] Step 3, put the substrate into the chemical copper equipment, and perform the conventional electroless copper p...

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Abstract

The invention discloses a method for electroless copper plating on a glass substrate. The method comprises the following steps: coating the glass substrate with a layer of organic film, and depositing a copper layer by adopting a traditional chemical copper plating process after the organic film layer is dried. The preparation method of the organic film comprises the following steps: (1) dissolving an organic film material with the volume percentage of 0.1 to 0.2 percent into a volatile organic solvent; (2) coating the glass substrate with the organic solvent in a rotation coating manner, a spraying manner, a soaking manner or a brushing manner; (3) drying or airing the glass substrate which is coated with the organic solvent; (4) carrying out the imidization or high-temperature curing for the glass substrate by adopting the material characteristics of the organic film material. By adopting the method, the problem that the traditional process is incompatible with the substrate process can be solved, the adhesion between the copper and the glass substrate can be improved, the influence of circuits on the substrate on the high-frequency electric property can be reduced, and the binding force between the circuit and the substrate can be improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to a method for electroless copper plating on glass. Background technique [0002] In recent years, with the development of semiconductor technology, advanced packaging technology has become more and more important in the IC manufacturing industry, and the substrate requirements in system-in-package technology are also getting higher and higher. The substrate is no longer just for mounting components. The PCB board is also used for the system-in-package interconnection of multiple chips, which puts forward higher requirements for the substrate material. Traditional substrate materials have high coefficient of thermal expansion, large loss, and poor dimensional stability. In recent years, various new substrate materials have been extensively studied, such as glass, ceramics and other materials. Glass substrates, ceramic substrates, etc. are also widely used in vari...

Claims

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Application Information

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IPC IPC(8): C03C17/38C23C18/18
Inventor 孙瑜于中尧
Owner NAT CENT FOR ADVANCED PACKAGING