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Chip component end encapsulation slurry and preparation method of chip component

A technology for encapsulating slurry and components, applied in the direction of coating resistance materials, resistors with negative temperature coefficients, etc., can solve the problem of only reaching about 40%, and achieve moderate viscosity, good chemical and physical properties, and reliability qualified effect

Active Publication Date: 2016-08-24
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Take the 0402 size chip negative temperature coefficient thermistor that is more common in the industry as an example. For a chip with a nominal resistance of 100kΩ at 25°C, the 1% accuracy pass rate of the chip produced by a non-high-precision process platform is less than or equal to 20%, which is high The 1% precision pass rate of the chips produced by the precision production process platform can only reach about 40%

Method used

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  • Chip component end encapsulation slurry and preparation method of chip component
  • Chip component end encapsulation slurry and preparation method of chip component
  • Chip component end encapsulation slurry and preparation method of chip component

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Experimental program
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Effect test

Embodiment 1

[0022] This embodiment provides a paste for encapsulating the end of a chip component made of mixing raw materials with different mass ratios. The metal powder, polymer resin, calcium carbonate, and organic solvent are mechanically stirred according to mass percentages of 40%: 20%: 20%: 20%, wherein the speed of mechanical stirring is 60-100r / min, more preferably 70% -90r / min, stirring and mixing to form an encapsulation slurry with a viscosity of about 150-170Pa*s at 25°C and a solid content of 70-80%.

[0023] In the embodiment of the paste for encapsulating the end of the chip component, the mass percentage of metal powder, polymer resin, calcium carbonate, and organic solvent can also be: 40%: 20%: 25%: 15%, or 45%: 20%: 20%: 15%, or 35%: 25%: 30%: 10%, or 40%: 15%: 35%: 10%.

[0024] In addition, it should be noted that silver powder is the best metal powder in this embodiment.

Embodiment 2

[0026] This embodiment provides a method for preparing a chip component by encapsulating the end of the chip component with an encapsulation slurry. This embodiment uses the example of using a thermistor high-precision chip as a chip component, and the encapsulation process of its end includes the following steps:

[0027] (1) Silver powder, polymer resin, calcium carbonate, and organic solvent are mixed according to the mass percentage of 40%: 20%: 25%: 15% respectively to form an encapsulation slurry, wherein the organic solvent can be propyl acetate and ethanol according to The ratio of mass percentage is 3:1 mixed mixture, and the polymer resin can be epoxy resin.

[0028] (2) Use a screen printing machine to print the prepared encapsulation slurry on the end of the high-precision chip of the thermistor on a screen of 300-450 mesh, and print an encapsulation protective layer with a thickness of 15-50 μm, such as figure 1 Shown is the thermistor high-precision chip 1 encap...

Embodiment 3

[0038] This embodiment also provides a method for preparing a chip component by encapsulating the encapsulating slurry on the end of the chip component. This embodiment also uses the example of using a thermistor high-precision chip as a chip component, and the encapsulation process of its end is basically the same as the preparation method of Embodiment 2. The difference is that in this embodiment, silver powder, polymer resin, carbonic acid Calcium and the organic solvent are respectively 45%: 20%: 20%: 15% by mass percentage.

[0039] Randomly select 30 0402 chips with a nominal resistance value of 47kΩ made according to the above formula, and test their resistance values, see Table 2 for details.

[0040] Table 2 (unit: kΩ)

[0041]

[0042]

[0043] In this embodiment, the high-precision thermistor product made by using the encapsulating slurry can have a 1% accuracy pass rate of 76.6%, and the encapsulating slurry can greatly ensure the improvement of electrical a...

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Abstract

The invention discloses a chip component end encapsulation slurry and a preparation method of the chip component, wherein the encapsulation slurry consists of 35-45% metal powder, 15-25% polymer resin, 20% by mass percentage ‑35% calcium carbonate and 10‑20% organic solvent, and mixed; the preparation method of the chip component includes the encapsulation process of the chip component, that is, the encapsulation slurry is encapsulated at the end of the chip component . The encapsulating slurry disclosed by the present invention has good stability in chemical and physical properties, good sealing performance, and moderate viscosity; the chip component made by encapsulating the encapsulating slurry on the end of the chip component solves the problem of chip components. The technical difficulty of terminal protection improves the 1% accuracy pass rate of the manufactured chip components.

Description

technical field [0001] The invention relates to a chip component end encapsulation slurry and a preparation method of the chip component. Background technique [0002] In recent years, with the rapid development of SMT technology for passive components, the market has higher and higher requirements for the electrical performance and stability of passive components. Thermistors with negative temperature characteristics are required to be fine-tuned while developing chips. Higher and higher. The chip produced by the original thermistor process platform has a low 1% accuracy pass rate, which makes it difficult to achieve mass production and cannot meet the market demand for high-precision thermistor chips. The development of a high-precision production process platform is a difficult problem to be overcome, especially the protection of high-precision chip terminals has become a key process. [0003] Take the 0402 size chip negative temperature coefficient thermistor that is m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C17/06
Inventor 王军包汉青黄飞
Owner SHENZHEN SUNLORD ELECTRONICS
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