Method of recovering gold and silver from a waste circuit board

A waste circuit board, gold and silver technology, applied in the improvement of process efficiency, photography technology, instruments, etc., can solve the problems of high cost, high toxicity, serious pollution, etc., and achieve high profit, quick effect, and high metal recovery rate. Effect

Inactive Publication Date: 2014-03-26
JIANGSU RONGYUAN REGENERATION RESOURCE TECHCO
View PDF8 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for recovering gold and silver from waste circuit boards, which is a non-toxic, high-efficiency and low-cost method for extracting copper, gold and silver, and overcomes the high cost and toxicity of the existing process in the recovery process. To realize the comprehensive utilization of metal resources, reduce electronic pollution, avoid the scarcity of non-ferrous metal resources, and reduce the pressure of electronic waste on the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: Recycle gold and silver in waste circuit boards according to the following steps

[0020] (1) Hot melting: put the waste circuit board on the detinning equipment, and detinning treatment at a temperature of 200°C. After detinning, the components and the substrate are separated, and the components and the substrate are collected separately;

[0021] (2) Treatment of separations: recovery of tin materials in the process of detinning, recovery of useful parts and aluminum parts in components;

[0022] (3) Sorting: crush the substrate of step (1) and the useless parts of step (2), and completely separate metal particles and non-metal particles by sorting;

[0023] (4) Briquetting electrolysis: The metal particles in step (3) are briquetted to make an electrolytic anode, the Cu in the electrolyte is 30g / L, the sulfuric acid is 150g / L, and the current density is 200A / m 2 Perform electrolysis to obtain copper at the cathode;

[0024] (5) Silver extraction: ...

Embodiment 2

[0026] Embodiment 2: Reclaim gold and silver in waste circuit boards according to the following steps

[0027] (1) Hot melting: Put the waste circuit board on the detinning equipment, and detinning treatment is carried out at a temperature of 275°C. After detinning, the components and the substrate are separated, and the components and the substrate are collected separately;

[0028] (2) Treatment of separations: recovery of tin materials in the process of detinning, recovery of useful parts and aluminum parts in components;

[0029] (3) Sorting: crush the substrate of step (1) and the useless parts of step (2), and completely separate metal particles and non-metal particles by sorting;

[0030] (4) Briquetting electrolysis: The metal particles in step (3) are briquetted to make an electrolytic anode, the Cu in the electrolyte is 40g / L, the sulfuric acid is 175g / L, and the current density is 235A / m 2 Perform electrolysis to obtain copper at the cathode;

[0031] (5) Silver e...

Embodiment 3

[0033] Embodiment 3: Reclaim gold and silver in waste circuit boards according to the following steps

[0034] (1) Hot melting: put the waste circuit board on the detinning equipment, and perform detinning treatment at a temperature of 350°C. After detinning, the components and the substrate are separated, and the components and the substrate are collected separately;

[0035] (2) Treatment of separations: recovery of tin materials in the process of detinning, recovery of useful parts and aluminum parts in components;

[0036] (3) Sorting: crush the substrate of step (1) and the useless parts of step (2), and completely separate metal particles and non-metal particles by sorting;

[0037] (4) Briquetting electrolysis: The metal particles in step (3) are briquetted to make an electrolytic anode, the Cu in the electrolyte is 50g / L, the sulfuric acid is 200g / L, and the current density is 270A / m 2 Perform electrolysis to obtain copper at the cathode;

[0038] (5) Silver extracti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method of recovering gold and silver from a waste circuit board. The method includes subjecting the waste circuit board to hot melt and separating soldering tin, components and substrates; recovering useful components in the components, smashing remaining components and the substrates, and sorting to separate plastic powder and metal powder; briquetting the metal powder and electrolyzing to obtain copper, and leaching electrolysis anode mud with nitric acid to recover the silver; and leaching filter residue with hydrochloric acid to recover the gold. The equipment and the method are simple. The silver and the gold in the circuit board can be effectively recovered. The recovery rate of the metals is high. Reutilization of resources of valuable metals in the waste circuit board is achieved. The method has great social benefit and economic benefit.

Description

technical field [0001] The invention relates to a processing method for electronic waste, in particular to a method for recovering gold and silver from waste circuit boards. Background technique [0002] With the development of science and technology, the update frequency of electronic products is accelerating. As the key and most basic component of various electronic equipment, printed circuit boards have become one of the main sources of electronic waste. There are many harmful substances and many valuable substances in waste circuit boards. Usually, the circuit board contains 30% plastic, 30% inert oxide and 40% metal. The base metal (Cu, Pb, Zn, etc.) contained in the metal is about 30%, and the precious metal (Au, Ag, Pt, etc.) ) content is about 0.5%. Therefore, recycling copper, gold, silver, etc. in circuit boards is the main driving force for the recycling of circuit boards. If it is not recycled, the heavy metals in the circuit board will cause soil and water po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B25/06C22B11/00C25C1/12C25C1/20C22B15/00C22B13/00C21B15/00
CPCY02P10/134Y02P10/20
Inventor 王佳东刘彦栋
Owner JIANGSU RONGYUAN REGENERATION RESOURCE TECHCO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap