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Device and process for a silicate phosphor and its surface-coated oxide diaphragm film

A surface coating, phosphor technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problems of difficult production process control, high temperature control requirements, high equipment requirements, etc.

Active Publication Date: 2016-06-22
江苏迈纳德微纳技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wet technology is mainly carried out in liquid medium, the requirements for equipment are simple, and the requirements for temperature control are high. The main disadvantage is that the coating layer is not uniform, and the thickness is usually too large.
In addition, the preparation process requires a large amount of pure water, and the amount of toxic and harmful waste liquid to be treated is large.
The traditional dry process is simpler than the wet process, and there is no waste liquid or a small amount of waste liquid, but the requirements for equipment are higher, and the temperature must be precisely controlled
In addition, the production process is not easy to control when using dry coating, and the coating quality is not high

Method used

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  • Device and process for a silicate phosphor and its surface-coated oxide diaphragm film
  • Device and process for a silicate phosphor and its surface-coated oxide diaphragm film
  • Device and process for a silicate phosphor and its surface-coated oxide diaphragm film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Select purchased Intermex orange phosphor powder 054465g as a sample, undeposited sample, denoted as 0#, deposit in a 4-inch model atomic layer deposition equipment, select a layer of phosphor deposition chamber, and deposit aluminum oxide diaphragm on the phosphor surface Thin film 30nm.

[0041] Put 5g of phosphor powder 05446 into the above-mentioned phosphor deposition chamber, then put the phosphor deposition chamber into the cavity, and proceed to the next step;

[0042] Turn on the carrier gas and pulse gas of the atomic layer deposition equipment, and set parameters: the chamber substrate temperature is set to 150°C, the chamber wall temperature is set to 180°C, the pulse actuator valve temperature is set to 160°C, and the precursor trimethylaluminum container The temperature is room temperature, the temperature of the precursor water container is set to 50°C, and the temperature of other pipelines is 150°C. The deposition process selects the precursor exposure...

Embodiment 2

[0046] Select purchased Intermex orange phosphor powder 054465g as a sample, undeposited sample, denoted as 0#, deposit in a 4-inch model atomic layer deposition equipment, select a layer of phosphor deposition chamber, and deposit aluminum oxide diaphragm on the phosphor surface Thin film 50nm.

[0047] Put 5g of phosphor powder 05446 into the above-mentioned phosphor deposition chamber, then put the phosphor deposition chamber into the cavity, and proceed to the next step;

[0048] Turn on the carrier gas and pulse gas of the atomic layer deposition equipment, and set parameters: the chamber substrate temperature is set to 150°C, the chamber wall temperature is set to 180°C, the pulse actuator valve temperature is set to 160°C, and the precursor trimethylaluminum container The temperature is room temperature, the temperature of the precursor water container is set to 50°C, and the temperature of other pipelines is 150°C. The deposition process selects the precursor exposure...

Embodiment 3

[0052] Select the purchased Intermex orange phosphor powder 055445g as the sample, the undeposited sample is denoted as 3#, deposit it in a 4-inch model atomic layer deposition equipment, select a layer of phosphor deposition chamber, and deposit aluminum oxide diaphragm on the phosphor surface Thin film 30nm.

[0053] Put 5g of phosphor powder 05544 into the above-mentioned phosphor deposition chamber, then put the phosphor deposition chamber into the cavity, and proceed to the next step;

[0054] Turn on the carrier gas and pulse gas of the atomic layer deposition equipment, and set parameters: the chamber substrate temperature is set to 150°C, the chamber wall temperature is set to 180°C, the pulse actuator valve temperature is set to 160°C, and the precursor trimethylaluminum container The temperature is room temperature, the temperature of the precursor water container is set to 50°C, and the temperature of other pipelines is 150°C. The deposition process selects the pre...

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Abstract

The invention discloses silicate type fluorescent powder as well as a device and process for coating an oxide diaphragm film on the surface of the fluorescent powder. A fluorescent powder special deposition chamber is arranged in the device and has a single-layer or multi-layer structure, wherein each layer of the deposition chamber consists of a fluorescent powder deposition area (1) and air passages (2) bestrewn around the deposition area (1), and the air passages are pipelines for feeding and discharging a precursor and carrier gas for atomic layer deposition. The invention realizes the aim of coating a diaphragm film layer at the periphery of the fluorescent powder by using an atomic layer deposition (ALD) technology to improve the performance of the fluorescent powder. The deposition chamber special for coating the fluorescent powder is invented on the basis of the ALD technology, and the process for atomic layer deposition is further improved to meet requirements for coating the fluorescent powder.

Description

technical field [0001] The invention relates to a fluorescent powder coating device and process. Background technique [0002] Today, fluorescent materials are not only limited to the traditional lighting display field, but also continue to expand to more application fields. According to the specific requirements of different research fields, the research of red, green, blue and yellow / white light-emitting materials has made great progress. The main purpose of the research and development of fluorescent materials is to explore materials with high luminous efficiency, short decay time, high color purity and good chemical stability that meet the application requirements, realize new high-efficiency, energy-saving and environment-friendly lighting imaging devices, and promote stable physical and chemical properties. Research and exploration of phosphorescent materials. [0003] A major problem facing the production and R&D technology of phosphor powder is the lifetime and sta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/455C23C16/452C23C16/40B22F1/02
Inventor 左雪芹梅永丰
Owner 江苏迈纳德微纳技术有限公司
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