Piezoelectric Valveless Micropump Sucker Based on Parallel Compliant Mechanism

A compliant mechanism and suction cup technology, which is applied in the field of special robots, can solve the problems of low power-to-weight ratio, unreducable size, and high noise, and achieve the effects of long dynamic period, light weight, and low energy consumption

CN103671462BInactive Publication Date: 2015-10-14SHANGHAI JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2015-10-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a piezoelectric valveless micropump suction cup based on a parallel connection compliant mechanism. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism comprises a monocrystalline silicon substrate, a copper-based composite film, the compliant mechanism and a piezoelectric stack driver. The compliant mechanism is provided with a deformation displacement input part, a deformation displacement output part and a locating groove. The piezoelectric stack driver is fixedly clamped at a hollowed-out position in the upper portion of the deformation displacement input part and is closely attached to the deformation displacement input part. The copper-based composite film located on the upper layer and the monocrystalline silicon substrate located on the lower layer are bonded together and assembled through epoxy structure bonding glue to form a thin film micropump. The thin film micropump is clamped into the locating groove of the compliant mechanism and is sealed in a bonding mode. The lower end face of the deformation displacement output part is attached to the upper plane of the copper-based composite film in a bonding mode. The compliant mechanism amplifies unidirectional deformation displacement generated after the piezoelectric stack driver is powered on, and then transmits the unidirectional deformation displacement to the copper-based composite film to drive the thin film micropump to operate, gas in an adsorption cavity formed in the lower portion of the monocrystalline silicon substrate is extracted, and negative pressure of the suction cup is generated. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism is small in size, light in weight, free of noise, and capable of being used as an adsorption device of a wall-climbing robot.
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Description

technical field

[0001] The invention relates to an adsorption device that can be used for a miniature wall-climbing robot, in particular to a piezoelectric valveless micro-pump sucker based on a parallel compliant mechanism, which belongs to the technical field of special robots. Background technique

[0002] Piezoelectric Ceramics is a functional ceramic material that can convert mechanical energy to electrical energy, and belongs to inorganic non-metallic materials. When a mechanical force is applied to some anisotropic dielectric crystals, the phenomenon of bound charges with opposite signs appearing on the surface of the crystal is called the positive piezoelectric effect; on the contrary, an electric field is applied to a dielectric crystal with piezoelectric effect, causing The phenomenon of deformation of the dielectric is called the inverse piezoelectric effect. Utilizing the inverse piezoelectric effect of piezoelectric materials, piezoelectric ceramics can be used...

Examples

Embodiment Construction

[0037] The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following Example.

[0038] Please refer to figure 1 and figure 2, which shows a piezoelectric valveless micropump chuck based on a parallel compliant mechanism, including a single crystal silicon substrate 1 , a copper-based composite film 2 , a compliant mechanism 4 and a piezoelectric stack driver 3 . The center of the top of the compliance mechanism 4 is provided with a deformation displacement input part 43, the center of the bottom part is provided with a deformation displacement output part 44, and the bottom of the compliance mechanism 4 is provided with a positioning groove 45; The stacked...