35results about How to "Deformation will not occur" patented technology

The invention relates to a suspension-type mobile socket, and the socket comprises a housing and a suspension piece. At least one side surface of the housing is provided with jacks connected with a plug. The interior of the jack is provided with a clamping head conductive piece. The suspension piece is suspended at an outer side of the housing, and the surface of the suspension piece is provided with elastic conductor contacts which are used for the conduction of a power supply. During operation, the elastic conductor contacts are connected with the clamping head conductive piece. Compared with the prior art, the socket is in a suspension-type structure, is simple and convenient in installation, is reliable in contact, is stable in power supply, and is flexible in use.

The invention relates to a suspension-type mobile socket, and the socket comprises a housing and a suspension piece. At least one side surface of the housing is provided with jacks connected with a plug. The interior of the jack is provided with a clamping head conductive piece. The suspension piece is suspended at an outer side of the housing, and the surface of the suspension piece is provided with elastic conductor contacts which are used for the conduction of a power supply. During operation, the elastic conductor contacts are connected with the clamping head conductive piece. Compared with the prior art, the socket is in a suspension-type structure, is simple and convenient in installation, is reliable in contact, is stable in power supply, and is flexible in use.

The invention relates to an automatic plate material finely cutting system. The automatic plate material finely cutting system comprises a supporting bottom plate, supporting columns, angle hydrauliccylinders, a positioning device, a positioning supporting plate, and cutting devices. The supporting columns are mounted on the top of the rear end of the supporting bottom plate. The rear end of thepositioning supporting plate is mounted on the tops of the supporting columns by hinges. The angle hydraulic cylinders are arranged at the bottom of the front end of the positioning supporting plate.The angle hydraulic cylinders are mounted between the supporting bottom plate and the positioning supporting plate by hinges. Cutting grooves are symmetrically formed in the outer end of the positioning supporting plate. The positioning device is mounted on the positioning supporting plate. The cutting devices are located at the upper end of the positioning supporting plate. The cutting devices are mounted on the top of the outer end of the supporting bottom plate. The automatic plate material finely cutting system can solve the problems that when corners of existing steel plates are cut, thesteel plates with different sizes can not be positioned, steel plate position adjusting is not smooth, steel plate cutting with different cutting edge inclinations can not be achieved, and the steel plates deform during cutting.

The invention relates to an aluminum-plastic film stamping equipment for a soft-packed lithium battery and its stamping process, including a support base plate, a transmission device, a cutting device and a stamping device. A transmission device is installed on the top of the left end of the support base plate, and the cutting device is installed On the middle part of the support base plate, the stamping device is connected with the right end top of the support base plate; the transmission device includes a transmission roll, a transmission rotating shaft, a rotating shaft support plate, a shifting plate, a buffer connecting frame, a rotating plate, a blocking frame and a buffer spring. The present invention can solve the problem that the aluminum-plastic film existing in the outer packaging of the soft-packed lithium battery cannot be automatically conveyed when it is punched, the wrinkle phenomenon occurs when the aluminum-plastic film is conveyed, the stamping die cannot be adjusted for stamping size, and the aluminum-plastic film cannot be automatically conveyed. The position around the aluminum-plastic film will be deformed during stamping, the aluminum-plastic film cannot be automatically cut, and the cutting effect of the aluminum-plastic film is poor.

The invention provides a semiconductor structure forming method. The method comprises the steps of providing a substrate; forming an opening in the substrate; forming a stress layer in the opening; forming an initial covering layer on the surface of the substrate and the surface of the stress layer, wherein the material of the initial covering layer is composed of an amorphous semiconductor material; converting the part of the initial covering layer, that is positioned on the surface of the stress layer, into a covering layer through the crystallization process, wherein the material of the covering layer is composed of a crystalline semiconductor material; and removing the initial covering layer that is not converted into the covering layer after the crystallization process. The formed semiconductor structure is good in morphology and stable in performance.

Disclosed are methods for forming an NMOS transistor and an MOS transistor. The method for forming the NMOS transistor comprises: providing a semiconductor substrate, wherein the NMOS transistor is formed on the semiconductor substrate; forming a tension silicon nitride layer on the semiconductor substrate, wherein the tension silicon nitride layer covers the side wall and the top surface of the gate of the NMOS transistor; forming a protection layer on the tension silicon nitride layer, wherein the protection layer exposes the tension silicon nitride layer on the top surface of the gate of the NMOS transistor; performing plasma treatment on the tension silicon nitride layer on the top surface of the gate of the NMOS transistor for the purpose of enhancing the young modulus of the tension silicon nitride layer on the top surface of the gate of the NMOS transistor; and removing the protection layer. In the embodiment of the invention, the stress of the tension layer is improved.

The invention relates to a telescopic insertion sheet type mobile socket which comprises a housing (1) and an insertion sheet (2). At least one side surface of the housing (1) is provided with jacks connected with a plug. The insertion sheet (2) is arranged inside the housing (1) in a telescopic way. Elastic conductor contacts (3) contacting the live wire, the earth wire and the zero line of a power source are arranged on the insertion sheet (2). When the mobile socket is in use, the insertion sheet (2) springs out of the housing (1) and further contacts the live wire, the earth wire and the zero line of the power source through the elastic conductor contacts (3) in a conduction way. The plug is then inserted into jacks on the housing (1). Compared with the prior art, the mobile socket has the advantages of simple installation, reliable contact, stable power supply, flexible use, etc.

The invention discloses a monitoring equipment fixing device with a vibration reducing function. The monitoring equipment fixing device comprises a baseplate and two inclined baffle plates, wherein the two ends of the baseplate are connected with one side of a bent part; the other side of the bent part is connected with the ends of the baffle plates; an arched plate is connected between the two baffle plates; multiple rows of roller sets are arranged on the inner arc surface of the arched plate; the roller sets are multiple rollers spaced in the vertical direction of the top end of the arched plate; the monitoring equipment fixing device further comprises a plurality of hoops; and the hoops penetrate through the ends of the two baffle plates, and are contacted with the outer arc surface of the arched plate. The two inclined baffle plates and the baseplate form a saddle-shaped space structure; the arched plate seals an opening of the saddle-shaped space structure; and the ends of the hoops penetrating through the two baffle plates are positioned on the outer arc surface of the arched plate to increase the stability of a mounting base so as to prevent the damage of monitoring equipment caused by instability of a bracket in the use process.

The invention discloses a novel push type writing pen which at least comprises a refill, a pen holder, a pressing cap, an elastic part, a pen clip housing, a pen clip elastic sheet, a joining elasticsheet, a bouncing mechanism and a pen clip, wherein the pen holder covers the outer side of the refill and a pen clip mounting hole is formed in the upper part of the pen holder; the pressing cap is movably arranged on the top of the pen holder in a sleeving manner; one end of the elastic part leans against the refill while the other end of the elastic part leans against the pen holder; the pen clip housing is located in the pen holder axially; the pen clip elastic sheet is arranged in the pen clip housing; the joining elastic sheet penetrating from the bottom of the pen clip housing is connected to the pressing cap; the bouncing mechanism is connected to a locking hole of the joining elastic sheet; the pen clip, successively penetrating the pen clip mounting hole and an opened hole partially, is arranged on the pen clip elastic sheet in a sleeving manner and is in butt joint to the pen clip elastic sheet, and the end part of the pen clip leans against the outer wall of the pen holder;and when an external force is applied to the pen clip and the end part of the pen clip is tend to be far away from the pen holder, the pen clip elastic sheet can deform elastically to provide an action force for restoring the pen clip. The novel push type writing pen is simple in structural design and simple to assemble. The pen clip which is elastic and forceful can fit clamped articles of different thicknesses, and the pen clip which is used for a long time does not lose efficiency.

The invention discloses a piezoelectric valveless micropump suction cup based on a parallel connection compliant mechanism. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism comprises a monocrystalline silicon substrate, a copper-based composite film, the compliant mechanism and a piezoelectric stack driver. The compliant mechanism is provided with a deformation displacement input part, a deformation displacement output part and a locating groove. The piezoelectric stack driver is fixedly clamped at a hollowed-out position in the upper portion of the deformation displacement input part and is closely attached to the deformation displacement input part. The copper-based composite film located on the upper layer and the monocrystalline silicon substrate located on the lower layer are bonded together and assembled through epoxy structure bonding glue to form a thin film micropump. The thin film micropump is clamped into the locating groove of the compliant mechanism and is sealed in a bonding mode. The lower end face of the deformation displacement output part is attached to the upper plane of the copper-based composite film in a bonding mode. The compliant mechanism amplifies unidirectional deformation displacement generated after the piezoelectric stack driver is powered on, and then transmits the unidirectional deformation displacement to the copper-based composite film to drive the thin film micropump to operate, gas in an adsorption cavity formed in the lower portion of the monocrystalline silicon substrate is extracted, and negative pressure of the suction cup is generated. The piezoelectric valveless micropump suction cup based on the parallel connection compliant mechanism is small in size, light in weight, free of noise, and capable of being used as an adsorption device of a wall-climbing robot.

An embodiment of the present invention provides a display device, which relates to the field of display technology. The display device provided by the embodiment of the present invention includes a display panel, the display panel is divided into a display area and a peripheral area surrounding the display area, and a plurality of pressure sensors are arranged in the peripheral area; the display device also includes at least one a vibrating device, the vibrating device is used to vibrate the display panel to release the stress accumulation in the display panel. The technical solution of the invention can improve the pressure detection accuracy of the pressure sensor.