Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flavored low-fat white mushroom crisp chip and preparation method thereof

A white mushroom and low-fat technology, which is applied in the field of flavor and low-fat white mushroom crisps and its preparation, can solve the problems of unseen ready-to-eat white mushroom crisps, destruction of nutrients, poor taste and color, etc., and achieve flavor retention Good, reduced carcinogens, uniform flavor substances

Inactive Publication Date: 2014-04-02
SHANDONG INST OF COMMERCE & TECH
View PDF6 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Analysis of edible fungus crisps on the market shows that the product has the following defects: high-temperature frying technology processing results in the destruction of a large number of nutrients, serious loss of flavor, high oil content, and easy production of carcinogens such as acrylamide; when the product is prepared by puffing technology, the processing time Long, the taste and color of the product are poor; there are few types of products and the taste is single
There is no ready-to-eat white mushroom crisps in the market

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A spicy low-fat mushroom crisp and a preparation method thereof, comprising the following steps:

[0032] (1) Pretreatment of white mushrooms: choose 1000 grams of white mushrooms with good development, no mechanical damage, and uniform quality as raw materials, mechanically peel them, wash them with electrolytic water for 3 times, each time for 3 minutes, put white mushrooms in a 2L protective In the color solution, the color protection solution is a mixture of 1% (w / v) sodium chloride solution and 0.2% (w / v) citric acid solution at a ratio of 1:1 (v / v), and the color protection time is 20 minutes ; Take out the white mushroom slices after color protection, put them in boiling water at 100°C for 6 minutes, and then place the white mushrooms in a hot air drying oven for drying at a hot air temperature of 70°C for 25 minutes;

[0033] (2) Preparation of impregnation solution:

[0034] First prepare konjac glucomannan-chitosan sol: add 5g konjac glucomannan to 2L electro...

Embodiment 2

[0045] A sweet and low-fat white mushroom chips and a preparation method thereof, comprising the following steps:

[0046] (1) Pretreatment of white mushrooms: choose 500 grams of white mushrooms with good development, no mechanical damage and uniform quality as raw materials, wash them with electrolytic water for 5 times after mechanical peeling, 1min / time, put white mushrooms in a 4L protective In the color solution, the color protection solution is prepared by mixing 1% (w / v) sodium chloride solution and 0.2% (w / v) citric acid solution at a ratio of 1:1 (v / v), and the color protection time is 30 minutes ; Take out the white mushroom slices after color protection, put them in boiling water at 90°C for 10 minutes, and then place the white mushrooms in a hot air drying oven for drying at a hot air temperature of 55°C for 30 minutes;

[0047] (2) Preparation of impregnation solution:

[0048] (3) First prepare konjac glucomannan-chitosan sol: add 10g konjac glucomannan to 4L e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of food processing and specifically relates to a flavored low-fat white mushroom crisp chip and a preparation method thereof. The flavored low-fat white mushroom crisp chip comprises the following materials in parts by weight: 1000 parts of white mushrooms, 5-10 parts of konjac glucomannan, 10-80 parts of chitosan, 10-60 parts of salt, 60-200 parts of isolated soybean protein and 40-200 parts of a nutrition balancing agent. The preparation method comprises the following steps: pre-treating the white mushrooms, preparing impregnation liquid, carrying out vacuum soaking and ultrasonic coating, carrying out quick-freezing and slicing, carrying out vacuum frying and dehydrating, removing oil, and packaging. The prepared flavored low-fat white mushroom crisp chip has the advantages of being low in fat content, uniform in color, crisp in mouthfeel, full in nutrition, complete in product shape and almost free of fractures.

Description

technical field [0001] The invention belongs to the technical field of food processing, and in particular relates to flavor and low-fat white mushroom chips and a preparation method thereof. Background technique [0002] Edible fungus is a nutritious food that is deeply loved by consumers. At present, the distribution forms of edible fungi in the market are mainly fresh products, dried products, pickled products and canned products. The product processing methods are simple, the form is single, and the output value of deep processing is low. Crispy chips are a kind of snack food with crispy taste and unique flavor, which is loved by consumers, especially young people, and has a broad market prospect. Compared with common fruit and vegetable raw materials, edible fungus has a soft tissue and is not easy to form. Therefore, edible mushroom crisps rarely enter the market as snack food. Analysis of edible fungus crisps on the market shows that the product has the following def...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A23L1/28A23L1/09A23L29/30A23L31/00A23L33/125
CPCA23L5/11A23L5/57A23L27/00A23L29/30A23L29/37A23L31/00A23P20/10A23P20/17A23V2002/00A23V2200/20A23V2200/132A23V2250/511A23V2250/5058A23V2250/154A23V2250/6422A23V2300/10A23V2300/24A23V2250/702A23V2250/7042A23V2250/7044A23V2250/7052A23V2250/1578A23V2250/1592A23V2250/1642A23V2250/161A23V2300/20A23V2300/48
Inventor 聂小宝程丽林张长峰张家国孙中琦
Owner SHANDONG INST OF COMMERCE & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com