Preparation method for high-viscosity resin casting body

A high-viscosity, resin-based technology, applied in the field of materials, can solve the problems of incomplete elimination of bubbles, unsatisfactory effects, and inability to truly characterize the mechanical properties of the resin system, so as to prevent performance inhomogeneity and eliminate bubbles.

Active Publication Date: 2014-04-02
NO 53 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is mainly suitable for room temperature curing with long pot life or heat curing resin system with low viscosity at room temperature, for resin systems with high viscosity at room temperature or even solid state and high viscosity when heated to the initial curing temperature , the above method cannot effectively eliminate the air bubbles in the resin, and cannot truly characterize the mechanical properties of the resin system
[0004]Aiming at the above problems, Zhang Xianjun et al. ("Plastic Industry" Vol· 26 No·6) used resin The method of adding active diluent to the system reduces the viscosity of the resin at room temperature and effectively reduces the air bubbles in the resin casting body, but this method changes the components of the original resin system and cannot accurately reflect the performance of the original resin
[0005] CN 201110288128 is aimed at phenolic resin, after pumping to a certain vacuum degree at a certain temperature, open the vacuum valve, and then vacuumize to the vacuum degree and then open the vacuum valve, so Repeated many times to eliminate the air bubbles in the resin system, but the effect of this method is not particularly ideal in the specific use process, and the air bubbles are not completely eliminated, especially for the resin system that still has a relatively high viscosity when the resin is close to the initial curing temperature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The main resin is a mixed system of E51 and E20 epoxy resin, the curing agent is 4,4-diaminodiphenyl sulfone, the curing accelerator is boron trifluoride monoethylamine, the ratio is 60:40:30:1, and the solvent is acetone .

[0020] Prepare epoxy resin / 4,4-diaminodiphenyl sulfone / boron trifluoride monoethylamine in proportion, heat the two resins to melt, stir and mix evenly, when the resin temperature is 95°C, add 4,4-diphenylsulfone in sequence Aminodiphenyl sulfone and boron trifluoride monoethylamine were mixed evenly, and the initial curing temperature of the system was determined to be 115° C. by DSC thermal analysis method.

[0021] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 200g of acetone (boiling point: 56°C) and dissolve completely to obtain a resin solution. Slowly add 90g of 4,4-diaminodiphenylsulfone into 80g of acetone until completely dissolved; dissolve 3g of boron trifluoride monoethylamine with 45g of acetone, and mix the three solu...

Embodiment 2

[0026] The resin system is the same as in Example 1, and the solvents are butanone and ethyl acetate.

[0027] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 180g of ethyl acetate (boiling point: 77°C) and dissolve completely to obtain a resin solution. Slowly add 90g of 4,4-diaminodiphenylsulfone into 90g of butanone (boiling point: 79°C) until completely dissolved; dissolve 3g of boron trifluoride monoethylamine with 50g of butanone, and mix the three solutions evenly.

[0028] Slowly add 80 g of methyl ethyl ketone to the above mixed solution under stirring, and stir evenly to obtain a mixed solution of a resin system for castings. The measured viscosity of the solution is 305 mPa·s.

[0029] Put the mold sprayed with release agent 1805 into a glass vacuum desiccator, and place it as a whole in a blast drying oven, and adjust the mold to a horizontal state. Pour the resin system to be tested into the mold, cover the desiccator, start the vacuum system, raise ...

Embodiment 3

[0032] The main resin is a mixed system of E51 and E20 epoxy resin, the curing agent is m-phenylenediamine, the ratio is 60:40:35, and the solvent is acetone.

[0033] Prepare epoxy resin / m-phenylenediamine in proportion, heat the two resins to melt, stir and mix evenly, when the resin temperature is 80°C, add m-phenylenediamine and mix evenly, and use DSC thermal analysis method to determine the initial curing temperature of the system is 86 ℃.

[0034] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 200g of acetone (boiling point: 56°C) and dissolve completely to obtain a resin solution. Slowly add 105g of m-phenylenediamine into 110g of acetone until completely dissolved, and mix the two solutions evenly.

[0035] Slowly add 20 g of acetone to the above mixed solution under stirring, and stir evenly to obtain a mixed solution of a resin system for castings. The measured viscosity of the solution is 220 mPa·s.

[0036] Put the mold sprayed with release agent 1...

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Abstract

The invention belongs to a macromolecular material evaluation technology. A resin matrix and / or a curing agent are / is dissolved or diluted through the dilution of a low-boiling-point solvent to resin and the characteristic that the low-boiling-point solvent is easy to discharge; the viscosity of a resin system at normal temperature is reduced; then heating is executed to remove the solvent and air bubbles in vacuum, including determination of initial curing temperature, dissolving and mixing, viscosity adjustment, bubble removal and curing processes. According to the method, the air bubbles formed in a high-viscosity resin casting forming process can be effectively eliminated; the non uniformity of the performance of the resin casting body, which is caused by deposition in the curing process, is prevented; the preparation method is suitable for resin systems which are liquid, semisolid and solid at the room temperature and also suitable for resin systems in which the curing agent, an accelerant and the like cannot be dissolved in main resin; the preparation method is particularly suitable for resin systems which are solid or semisolid under the room temperature and are still extremely high in viscosity after being heated to the initial curing temperature.

Description

technical field [0001] The invention belongs to the field of material technology, relates to polymer material molding technology, in particular to a high-viscosity resin evaluation technology. Background technique [0002] The preparation of resin castings has a decisive reference value for evaluating the performance of the resin system, and is the basis for comparing the performance of resins. Therefore, whether a new resin formulation casting can be correctly prepared determines whether the resin system is in production. be successfully applied. [0003] At present, the resin casting body is mainly prepared according to the method described in GB / T257-1995. The resin, curing agent and accelerator are mixed evenly according to the proportion, and then the mixed resin glue is placed in a vacuum oven to evacuate several times. Time, then slowly and continuously pour the resin into the horizontal mold coated with release agent, and cure in the blast drying oven according to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/02B29C39/44B29C39/42
Inventor 郑志才王强葛林海陈艳孙士祥王尚孟祥武
Owner NO 53 RES INST OF CHINA NORTH IND GRP
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