A kind of preparation method of high-viscosity resin cast body
A high-viscosity, resin technology, applied in the field of materials, can solve the problems of incomplete bubble elimination, unsatisfactory effect, and inability to effectively eliminate resin bubbles, and achieve the effect of eliminating bubbles and preventing performance inhomogeneity.
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Embodiment 1
[0019] The main resin is a mixed system of E51 and E20 epoxy resin, the curing agent is 4,4-diaminodiphenyl sulfone, the curing accelerator is boron trifluoride monoethylamine, the ratio is 60:40:30:1, and the solvent is acetone .
[0020] Prepare epoxy resin / 4,4-diaminodiphenyl sulfone / boron trifluoride monoethylamine in proportion, heat the two resins to melt, stir and mix evenly, when the resin temperature is 95°C, add 4,4-diphenylsulfone in sequence Aminodiphenyl sulfone and boron trifluoride monoethylamine were mixed evenly, and the initial curing temperature of the system was determined to be 115° C. by DSC thermal analysis method.
[0021] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 200g of acetone (boiling point: 56°C) and dissolve completely to obtain a resin solution. Slowly add 90g of 4,4-diaminodiphenylsulfone into 80g of acetone until completely dissolved; dissolve 3g of boron trifluoride monoethylamine with 45g of acetone, and mix the three solu...
Embodiment 2
[0026] The resin system is the same as in Example 1, and the solvents are butanone and ethyl acetate.
[0027] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 180g of ethyl acetate (boiling point: 77°C) and dissolve completely to obtain a resin solution. Slowly add 90g of 4,4-diaminodiphenylsulfone into 90g of butanone (boiling point: 79°C) until completely dissolved; dissolve 3g of boron trifluoride monoethylamine with 50g of butanone, and mix the three solutions evenly.
[0028] Slowly add 80 g of methyl ethyl ketone to the above mixed solution under stirring, and stir evenly to obtain a mixed solution of a resin system for castings. The measured viscosity of the solution is 305 mPa·s.
[0029] Put the mold sprayed with release agent 1805 into a glass vacuum desiccator, and place it as a whole in a blast drying oven, and adjust the mold to a horizontal state. Pour the resin system to be tested into the mold, cover the desiccator, start the vacuum system, raise ...
Embodiment 3
[0032] The main resin is a mixed system of E51 and E20 epoxy resin, the curing agent is m-phenylenediamine, the ratio is 60:40:35, and the solvent is acetone.
[0033] Prepare epoxy resin / m-phenylenediamine in proportion, heat the two resins to melt, stir and mix evenly, when the resin temperature is 80°C, add m-phenylenediamine and mix evenly, and use DSC thermal analysis method to determine the initial curing temperature of the system is 86 ℃.
[0034] Add 180g of Epoxy Resin E51 and 120g of Epoxy Resin E20 into 200g of acetone (boiling point: 56°C) and dissolve completely to obtain a resin solution. Slowly add 105g of m-phenylenediamine into 110g of acetone until completely dissolved, and mix the two solutions evenly.
[0035] Slowly add 20 g of acetone to the above mixed solution under stirring, and stir evenly to obtain a mixed solution of a resin system for castings. The measured viscosity of the solution is 220 mPa·s.
[0036] Put the mold sprayed with release agent 1...
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