Unlock instant, AI-driven research and patent intelligence for your innovation.

A Nanowire Arrangement and Positioning Method Based on Ridge Electrode Structure

A technology of electrode structure and positioning method, applied in microstructure technology, microstructure device, manufacturing microstructure device, etc., can solve problems such as expensive, damaged nanowires, breakdown, etc.

Active Publication Date: 2016-01-13
SHENZHEN MICRO & NANO INTEGRATED CIRCUITS & SYST RES INST
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current electric field force alignment methods all use a planar electrode structure. In order to achieve precise positioning, the width of the electrode must be close to or smaller than the diameter of the nanowire.
Preparation of nanoscale electrodes requires the use of expensive electron beam lithography equipment; and the voltage applied to the electrodes can cause breakdown or even damage the nanowires

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A Nanowire Arrangement and Positioning Method Based on Ridge Electrode Structure
  • A Nanowire Arrangement and Positioning Method Based on Ridge Electrode Structure
  • A Nanowire Arrangement and Positioning Method Based on Ridge Electrode Structure

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0042] First, a layer of SiO is oxidized on the surface of the silicon substrate 1 2 Thin layer, by photolithography, etching process on the surface of the silicon substrate to prepare thin strips of SiO 2 thin layer as a mask 6( Figure 6 ); Next, anisotropic wet etching ( Figure 8 a and Figure 8 Shown in b), the ridge structure 2 is prepared on the silicon substrate 1 ( figure 1 a and figure 1 as shown in b);

[0043] Secondly, by photolithography and coating process, two strip electrodes 3 are respectively prepared at the two ends of the ridge structure 2 ( figure 2 a and figure 2 Shown in b); Then on the substrate 1 that has prepared ridge structure 2 and electrode, spin coating colloid 4 thin layers ( image 3 a and image 3 as shown in b);

[0044] Finally, the solution containing GaAs nanowires 5 is dropped on the surface of the substrate 1; since the electric field intensity at the tip is the largest, the AC electric field force applied on the electrodes m...

example 2

[0046] First, grow a layer of SiN on the surface of GaAs substrate 1 x Thin layer, by photolithography, etching process on the surface of the substrate 1 to prepare thin strips of SiN x thin layer as a mask 6( Figure 6 ); Next, wet etching ( Figure 7 a and Figure 7 Shown in b), the ridge structure 2 is prepared on the silicon substrate 1 ( figure 1 a and figure 1 as shown in b);

[0047] Secondly, by photolithography and coating process, two strip electrodes 3 are respectively prepared at the two ends of the ridge structure 2 ( figure 2 a and figure 2 shown in b); then cover the colloid on the substrate with ridge structure and electrode ( image 3 a and image 3 as shown in b);

[0048] Finally, the solution containing GaN nanowires 5 is dropped on the surface of the substrate 1; since the electric field intensity at the tip is the largest, the electric field force applied on the two electrodes makes the nanowires 5 positioned on the top of the ridge electrode (...

example 3

[0050] First, grow a layer of SiO on the surface of the silicon substrate 2 Thin layer, prepare two slender strips of SiO on the surface of silicon substrate 1 by photolithography and etching process 2 thin layer as a mask 6( Figure 6 ); Next, anisotropic wet etching ( Figure 8 a and Figure 8 As shown in b), prepare two sections of ridge structures 2 on the silicon substrate 1 ( Figure 9 a and Figure 9 as shown in b);

[0051] Secondly, by photolithography and coating process, two strip electrodes 3 are respectively prepared on the two sections of ridge structures; then the substrate with ridge structures 2 and electrodes 3 is covered with colloid ( Figure 9 a and Figure 9 as shown in b);

[0052] Finally, the solution containing InAs nanowires 5 is dropped on the surface of the substrate 1; since the electric field intensity at the tip of the ridge structure 2 is the largest, the electric field force applied on the two electrodes makes the nanowires positioned o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a nanowire arranging and positioning method based on a ridge electrode structure. The nanowire arranging and positioning method is characterized in that: nanowires are accurately arranged on the top of the ridge electrode structure using electric field force based on electric field intensity maximum effect of the top of the ridge electrode structure. The side wall of the ridge electrode structure prepared on a single crystal material substrate is always composed of the family of crystal planes, such as {110} and {111}, so that pointed cone width of the ridge electrode structure can be nanoscaled, and accurate arranging and positioning of nanowires is realized; in addition, colloid on the top of the ridge electrode structure is capable of preventing the nanowires from breakdown and damages caused by the electric field effectively. The nanowire arranging and positioning method is simple, and is suitable for large-scaled preparation.

Description

technical field [0001] The invention relates to a nanowire arrangement and positioning method, which can be used in the preparation of nanowire devices. Background technique [0002] Nanotechnology is considered to be one of the three major science and technologies of the 21st century. Among them, semiconductor nanowires are considered to be the basic structure of future micro-nano devices due to their unique one-dimensional quantum structure [Mater. Today, 9 (2006) 18-27]. In recent years, the research work of semiconductor nanowires has made great progress, and its application fields include integrated circuits [Nature, 470 (2011) 240-244], transistors [NanoLetters, 8 (2008) 925-930], lasers [Science, 292 (2001) 1897-1899], biosensors [Analytical Chemistry, 83 (2011) 1938-1943], light-emitting diodes [NanoLetters, 6 (2006) 1719-1722], and solar cells [NanoLett., 10 (2010) 1082-1087 ]Wait. [0003] Although semiconductor nanowires have very important application prospect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81B7/00
Inventor 黄辉渠波刘蓬勃
Owner SHENZHEN MICRO & NANO INTEGRATED CIRCUITS & SYST RES INST