Metal substrate based sintering temperature adjustable thick film circuit resistor paste and preparation process thereof

A technology of sintering temperature and metal substrate, which is applied in the manufacture of conductive materials, circuits, and cables/conductors dispersed in non-conductive inorganic materials. It can solve the problems of narrow sintering process window, high cost and poor stability, and achieve sintering performance. Good, stable resistance and uniform temperature field of components

Inactive Publication Date: 2014-04-16
湖南利德电子浆料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the resistance paste is the main body of heating, with high cost, poor stability and narrow sintering process window
So far, there have been no r

Method used

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  • Metal substrate based sintering temperature adjustable thick film circuit resistor paste and preparation process thereof

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Experimental program
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Effect test

Embodiment 1

[0020] 1. Two glass-ceramic formulas and preparation processes are: CaO43%, SiO 2 32%, TiO 2 7%, Al 2 o 3 15%, ZrO 2 3%, at 1350°C for 120 minutes; Bi 2 o 3 54%, SiO 2 21%, B 2 o 3 8%, Al 2 o 3 12%, ZrO 2 5% at 1150°C for 120 minutes.

[0021] 2. Preparation of glass powder: crushing on a roller mill → planetary ball mill → the average particle size of the powder is 3-4 μm, and the maximum particle size is less than 31 μm.

[0022] 3. The weight ratio of silver powder and palladium powder is 93:7, and the average particle size of silver-palladium alloy powder is less than 2 μm.

[0023] 4. Organic solvent formula and cooking process: terpineol 68%, tributyl citrate 8%, alcohol ester twelve 15%, ethyl cellulose 3%, hydrogenated castor oil 2%, lecithin 4%.

[0024] 5. Comprehensive pulping: CaO—SiO 2 —TiO 2 —Al 2 o 3 Glass and Bi 2 o 3 —SiO 2 —Al 2 o 3 —B 2 0 3 The system is mixed in a ratio of 6:4; the ratio of silver-palladium alloy powder and glass pow...

Embodiment 2

[0031] 1. Two kinds of glass-ceramic formulations and preparation processes are: CaO52%, SiO 2 25%, TiO 2 4%, Al 2 o 3 13%, ZrO 2 6%, 120 minutes at 1350°C; Bi 2 o 3 42%, SiO 2 33%, B 2 o 3 6%, Al 2 o 3 17%, ZrO 2 2% at 1150°C for 120 minutes.

[0032] 2. Preparation of glass powder: crushing on a roller mill → planetary ball mill → the average particle size of the powder is 3-4 μm, and the maximum particle size is less than 31 μm.

[0033] 3. The weight ratio of silver powder and palladium powder is 96:4, and the average particle size of silver-palladium alloy powder is less than 2 μm.

[0034] 4. Organic solvent formula and cooking process: 77% terpineol, 3% tributyl citrate, 12% alcohol ester twelve, 4% ethyl cellulose, 3% hydrogenated castor oil, 1% lecithin.

[0035] 5. Comprehensive pulping: CaO—SiO 2 —TiO 2 —Al 2 o 3 Glass and Bi 2 o 3 —SiO 2 —Al 2 o 3 —B 2 0 3 The system is mixed at a ratio of 5:5; the ratio of silver-palladium alloy powder and ...

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Abstract

The invention discloses a metal substrate based sintering temperature adjustable thick film circuit resistor paste and the preparation process thereof. The metal substrate based sintering temperature adjustable thick film circuit resistor paste is formed by a functional phase and an organic carrier; the ratio of the functional phase and the organic carrier is 70 to 80 to 20 to 30; the functional phase is mainly formed by, by weight, 25 to 50% of silver palladium alloy powder and 50 to 75% of microcrystalline glass powder. The preparation process comprises the preparation of the microcrystalline glass powder, the match of microcrystalline glass, the boiling of the organic solvent carrier and the integrated preparation of the resistor paste. According to the metal substrate based sintering temperature adjustable thick film circuit resistor paste, the square resistance is as low as 50 to 100 milliohms every meter, the temperature coefficient is small, the controllability is good, the sintering temperature can be adjusted to 550 to 850 DEG C, the electrical property is good, and the wetting property with and the compatibility to a medium paste and a conductor paste is excellent. The metal substrate based sintering temperature adjustable thick film circuit resistor paste and the preparation process thereof are suitable for ferrite series of stainless steel substrates.

Description

technical field [0001] The invention relates to a thick-film circuit resistance slurry based on a stainless steel metal substrate and its preparation technology, in particular to a series of substrates based on ferritic stainless steel. Background technique [0002] At present, in the field of electric heating, new thick film heating elements require small size, high power density, fast heat transfer, high thermal efficiency, low energy consumption, uniform temperature field, rapid heat start, good manufacturability, environmental protection, safety and reliability. Now there have been coffee pots and water heaters that use stainless steel based on metal substrates as the main heating body. Some domestic colleges and universities have also carried out research and development of stainless steel series paste, including dielectric paste, resistance paste, conductor paste and encapsulation paste. Among them, the resistance paste is the main body of heating, which has high cost...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/16H01B13/00H05B3/12
Inventor 刘飘肖俊杰刘飞全凌果胡蔚
Owner 湖南利德电子浆料股份有限公司
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