Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering

A technology of magnetron sputtering and metal plating, which is applied in the direction of sputtering plating, metal material coating process, ion implantation plating, etc., to achieve high production efficiency, good process stability and repeatability, and the effect of tight and firm film

Active Publication Date: 2014-04-23
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are no relevant published technologies and reports on the continuous plating of metal conductive functional films on the surface of flexible filament fibers using magnetron sputtering technology.

Method used

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  • Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering
  • Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering
  • Device and method for continuously coating fiber with metallic conductive function film through magnetron sputtering

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Embodiment Construction

[0037] The monofilament fiber is first passed through the tension controller 2 by the unwinding device 1, and then passes through the guide device A3 and the guide device B4 to form a 4-turn cycle so that the fiber thread passes through the plasma cleaning device 9 in parallel for cleaning and coarsening treatment. The distance is 60mm, and the power 50W. The processed fiber thread is transferred from the guide device A3 to the guide device C5, and the guide device C5 and the guide device D6 form a pair of turns, and the number of turns is 18 turns, so that the fiber thread passes through the plasma-assisted coating device 10 (the distance is 80mm, the power 10W) and a rectangular magnetron sputtering target 11 (distance 170mm, power 90W), and finally adjust the position of the fiber thread through the fiber displacement device 17, so that the fiber thread is collected in the winding device 7.

[0038] After the fiber thread is wound, the vacuum chamber is evacuated to 2.0×10 ...

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Abstract

The invention discloses a device and a method for continuously coating a fiber with a metallic conductive function film through magnetron sputtering, and belongs to the field of vacuum film coating. The method comprises the following steps: winding fiber filaments around an unwinding device; putting the unwinding device into a vacuum chamber for filament moving; cleaning and roughening the fiber filaments unwound by the unwinding device through a plasma cleaning device repeatedly in parallel; performing film coating on the cleaned fiber filaments through an auxiliary plasma film coating device and a rectangular magnetron sputtering target repeatedly in parallel; winding the film-coated fiber filaments around a winding device so as to complete film coating. During cleaning and surface roughening through the plasma cleaning device, introduced gas is mixed gas of oxygen and argon, oily substances on the fiber are decomposed, and meanwhile, the surface of the fiber is roughened to increase the adhesion force of the film. The auxiliary plasma film coating device is used for increasing the adhesion force of the film through ion bombardment. According to the device and the method, the defects of pollution, high operation cost, poor adhesion force and the like in the prior art are overcome. The device and the method have the advantages of uniform coating, impurity elimination, high adhesion force and the like.

Description

technical field [0001] The invention relates to the field of fiber vacuum coating technology and the field of plasma discharge, and provides a device and a process method for producing high-performance conductive fibers by using plasma magnetron sputtering technology. A metal film layer is coated on the surface of ordinary non-conductive fibers, and A well-bonded metal film layer is formed on the surface, so that the fiber has good electrical conductivity. Background technique [0002] Flexible electronic devices are technologies that deposit electronic functional units on flexible substrates to form circuits. Compared with traditional electronic devices, flexible electronic devices have the characteristics of portability, transparency, light weight, stretch / bend, and easy rapid and large-area printing, resulting in many new applications: such as flexible displays, thin-film solar cells, large-area sensors and actuators, etc. [0003] However, the substrates of traditional...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/56
Inventor 张跃飞王从曾屠金磊
Owner BEIJING UNIV OF TECH
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