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A high-frequency heat-pressing adhesive

A high-frequency hot pressing and adhesive technology, applied in the directions of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of reduced sheet strength, complex production process, and increased formaldehyde content, and reduce production costs. , the effect of low free formaldehyde content

Active Publication Date: 2015-09-30
顶立新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, melamine-formaldehyde resin or urea-formaldehyde resin contains a large amount of formaldehyde, which is easily decomposed under high temperature and high pressure, resulting in an increase in formaldehyde content, and the produced boards cannot meet the E-0 standard
If the hot pressing temperature is lowered, the strength of the sheet will decrease
At the same time, the production process is complicated and requires a long drying process

Method used

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  • A high-frequency heat-pressing adhesive
  • A high-frequency heat-pressing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0029] The formula of embodiment 1-5 is shown in the table below,

[0030]

Example 1

Example 2

Example 3

Example 4

Example 5

A-1

100

100

100

A-2

100

A-3

100

B-1

1

3

8

B-2

4

1

C-1

0.1

1

2

C-2

5

C-3

8

[0031] Among them, the meanings and sources of A-1, A-2, A-3, B-1, B-2, C-1, C-2 and C-3 are as follows:

[0032] A-1 melamine-modified urea-formaldehyde resin is MUF-960 melamine-modified urea-formaldehyde resin produced by Jiangmen Xinhui Lvyuan Adhesive Raw Materials Co., Ltd.

[0033] A-2 phenol-modified urea-formaldehyde resin is a phenol-modified urea-formaldehyde resin produced by Guangzhou Zhujiang Chemical Group Co., Ltd. Guangzhou Paint Factory.

[0034] A-3 Resorcinol-m...

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Abstract

The invention provides a high-frequency hot pressing adhesive, which is characterized by including urea formaldehyde resin, a curing agent and an imidazole-isocyanate adduct. In the invention, a low-cost composite board adhesive with a low free formaldehyde content and in line with environmental protection requirements is developed, the adhesive maintains all the excellent performance of a urea-formaldehyde resin adhesive, and the production cost is reduced, so that the high-frequency hot pressing adhesive is a practical adhesive completely bearable by all composite board processing enterprises.

Description

technical field [0001] The invention relates to a high-frequency hot-pressing adhesive. Background technique [0002] The high-frequency heating method used in the production of wood-based panels belongs to the high-frequency dielectric heating method. This technology is a new technology developed in recent decades and is widely used. It is mainly used in wood gluing and wood drying in the wood processing industry. High-frequency dielectric heating is a kind of direct heating, the electric field energy directly acts on the medium molecules, and the heating is carried out simultaneously from all places in the medium. The outstanding advantages of this kind of heating are: rapid, uniform and selective heating, applied to wood drying, softening and gluing treatment, not only can significantly shorten the heating time of wood, but also help to improve the quality of wood. [0003] The high-frequency hot pressing method is used for wood-based panels, and the process includes th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/30C09J161/32C09J11/06C09J11/04B27D1/04
Inventor 陆林森
Owner 顶立新材料科技股份有限公司
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