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Epoxy resin compound and radiant heat circuit board using the same

A technology of epoxy resin and composition, which is applied in the direction of circuit substrate materials, printed circuits, circuit heating devices, etc., can solve problems such as difficult handling, weak heat resistance, mechanical strength and tension, and achieve improved voltage resistance and ensure Coating performance, effect of improving dispersion stability

Active Publication Date: 2014-05-28
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the above-mentioned epoxy resin is in a liquid phase at room temperature, it is difficult to handle it, and the above-mentioned epoxy resin exhibits weak heat resistance, mechanical strength and tension

Method used

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  • Epoxy resin compound and radiant heat circuit board using the same
  • Epoxy resin compound and radiant heat circuit board using the same
  • Epoxy resin compound and radiant heat circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0070] Hereinafter, the present disclosure will be described in more detail through embodiments.

[0071] The thermal conductivity was measured by an abnormal heat conduction scheme using a thermal conductivity meter LFA447 manufactured by NETZSCH.

[0072]The epoxy resin composition is coated on the Al substrate and cured, and then the Al substrate is bent at 180 degrees and returned to the original position, and the peeling performance of Al is represented by the delamination degree (delmaination degree) of the epoxy resin composition . Record when the degree of delamination is less than 0.2 cm. Record when the degree of delamination is in the range of 0.2 cm to 1 cm. Record when the degree of delamination is 1 cm or greater.

Embodiment approach 1

[0074] 3w% bisphenol F, 2w% o-cresol novolac, 1w% 4,4' oxobis (N-(4-(epoxy-2-ylmethoxy) benzylidene) aniline ( 4,4'oxybis(N-(4-(oxiran-2-ylmethoxy)benzylidene)-aniline)), 1w% NC-3000H epoxy resin (Nippon Kayaku co.,Ltd), 1w% DAS curing agent, 1.5w% of the DAS curing accelerator, 0.25w% of BYK-W980 and 0.25w% of the rubber additive represented in Chemical Formula 2 were mixed with each other and stirred at a temperature of 40° C. for 10 minutes. Thereafter, into the mixture was introduced 90w% aluminum oxide inorganic filler, and stirred at room temperature for 20 minutes to 30 minutes to prepare the crystalline epoxy resin composition of embodiment 1.

[0075] The thermal conductivity was measured by an anomalous thermal conductivity method using a thermal conductivity meter LFA447 manufactured by NETZSCH.

[0076] The heat of fusion was measured at a heating rate of 10 / min using a differential scanning calorimeter (DSC Q100 manufactured by TA Instruments Waters).

[0077] G...

Embodiment approach 2

[0079] 3w% bisphenol F, 2w% o-cresol novolac, 1w% 4,4' oxobis (N-(4-(epoxy-2-ylmethoxy)benzylidene) aniline, 1w% of NC-3000H epoxy resin (Nippon Kayaku co.,Ltd), 1w% of DAS curing agent, 1.5w% of DAS curing accelerator, 0.15w% of BYK-W980 and 0.35w% of chemical formula 2 The rubber additives are mixed with each other and stirred at a temperature of 40 ° C for 10 minutes. Then, 90w% of alumina inorganic filler is introduced into the mixture, and stirred at room temperature for 20 minutes to 30 minutes to obtain the crystal of embodiment 2 epoxy resin composition.

[0080] The thermal conductivity was measured by an anomalous thermal conductivity method using a thermal conductivity meter LFA447 manufactured by NETZSCH.

[0081] The heat of fusion was measured at a heating rate of 10 / min using a differential scanning calorimeter (DSC Q100 manufactured by TA Instruments Waters).

[0082] Glass transition temperature was measured using a DSC Q100 calorimeter manufactured by TA In...

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Abstract

Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Description

technical field [0001] The present disclosure relates to an epoxy resin composition. More specifically, the present disclosure relates to an epoxy resin composition for use as an insulating layer of a radiant heating circuit board. Background technique [0002] The circuit board includes circuit patterns mounted on an electrically insulating substrate, and is used to mount electronic components thereon. [0003] These electronic components may include heat generating devices, such as light emitting diodes (LEDs), which emit large amounts of heat. The heat emitted by the heating device increases the temperature of the circuit board, causing the heating and light device to fail to work normally and reducing the reliability of the heating device. [0004] Therefore, in the circuit board, the heat radiation structure is very important for heat dissipation from the electronic components to the outside, and the thermal conductivity of the insulating layer formed in the circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/00C08G59/22H05K7/20
CPCC08L63/00H05K1/0346H05K1/056C08L21/00C08K3/22C08K3/28C08K3/36C08K3/38H05K1/0373C08G59/22C08K3/00H05K1/03H05K7/20H05K1/0203
Inventor 文诚培金海燕朴宰万尹钟钦赵寅熙
Owner LG INNOTEK CO LTD
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