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Preparation method of environment-friendly one-component solvent-free epoxy impregnation resin

An impregnating resin, one-component technology, applied in the field of preparation of environment-friendly one-component solvent-free epoxy impregnating resin, which can solve the problems of shortened resin pot life, high viscosity, impregnated parts directly put into resin, etc., to achieve uniform mixing Effect of preventing and improving film thickness

Active Publication Date: 2016-08-17
GOODE EIS SUZHOU CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. When the product is in use, the impregnated parts exceeding 54°C cannot be directly put into the resin, otherwise, the service life of the resin will be severely shortened
[0010] 2. The viscosity is slightly higher, only suitable for VPI dipping paint

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1) According to the ratio of 3:5 by weight, bisphenol A and bisphenol F with a viscosity of 4000 at 25°C are used to form a high-purity epoxy resin mixed system;

[0030] 2) Preparation of modified diaminodiphenylsulfone DDS: modify the diaminodiphenylsulfone curing agent with bismaleimide at a molar ratio of 0.5:1, and place the above-mentioned The proportion of the material is reacted at 150°C, the reaction time is 1 hour, and the material can be discharged after cooling to 40°C, and the modified diaminodiphenylsulfone DDS is obtained;

[0031] 3) Heat the mixed system of bisphenol A and bisphenol F high-purity epoxy resin to 40°C, and add modified diaminodiphenylsulfone DDS, the amount of modified diaminodiphenylsulfone added is the high-purity ring 45% of the weight of the oxygen resin mixing system, disperse and stir at a high speed, and add a silicon dioxide thixotropic agent, and the thixotropic agent is added at 0.5% of the total material weight.

[0032] The p...

Embodiment 2

[0034] 1) According to the ratio of 3:7 by weight, bisphenol A and bisphenol F with a viscosity of 6000CPS at 25°C are used to form a high-purity epoxy resin mixed system;

[0035] 2) Preparation of modified diaminodiphenylsulfone DDS: modify the diaminodiphenylsulfone curing agent with bismaleimide at a molar ratio of 3:1, and place the above-mentioned The proportion of the material is reacted at 100°C, the reaction time is 3 hours, and the material can be discharged after cooling to 50°C, and the modified diaminodiphenylsulfone DDS is obtained;

[0036] 3) Heat the mixed system of bisphenol A and bisphenol F high-purity epoxy resin to 80°C, and add modified diaminodiphenylsulfone DDS, the amount of modified diaminodiphenylsulfone added is the high-purity ring 20% of the weight of the oxygen resin mixing system, disperse and stir at a high speed, and add a silicon dioxide thixotropic agent, and the thixotropic agent is added at 2% of the total material weight.

[0037] Prefe...

Embodiment 3

[0039] 1) According to the weight ratio of 4:6, bisphenol A and bisphenol F with a viscosity of 5000CPS at 25°C are used to form a high-purity epoxy resin mixed system;

[0040] 2) Preparation of modified diaminodiphenylsulfone DDS: modify the diaminodiphenylsulfone curing agent with bismaleimide at a molar ratio of 1:1, and place the above-mentioned The proportion of the material is reacted at 120°C, the reaction time is 2 hours, the material can be discharged after cooling to 45°C, and the modified diaminodiphenylsulfone DDS is obtained;

[0041] 3) Heat the mixed system of bisphenol A and bisphenol F high-purity epoxy resin to 60°C, and add modified diaminodiphenylsulfone DDS. 35% of the weight of the oxygen resin mixing system, disperse and stir at a high speed, and add a silicon dioxide thixotropic agent, and the thixotropic agent is added at 1% of the total material weight.

[0042]Preferably, the particle size ratio of the silicon dioxide thixotropic agent in the prese...

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PUM

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Abstract

The invention discloses a preparation method of an environment-friendly single-component solvent-free epoxy impregnating resin. By adopting a medium-viscosity high-purity epoxy resin, adding a latent curing agent modified diamino diphenyl sulfone (DDS) through physical and chemical reactions, and adding silicon dioxide thixotropic agents of 400 meshes, 800 meshes and above, which are mixed according to a ratio, uniform mixing can be effectively ensured, precipitation is prevented, excessive resin amount is remained in a loose winding can be well ensured, and the film-forming thickness of the resin on an enamelled wire and insulation belt can be improved.

Description

technical field [0001] The invention relates to a method for preparing an environment-friendly one-component solvent-free epoxy impregnating resin. The products prepared by the method can be applied to the fields of low-voltage stators, armatures and various motors. Background technique [0002] With the improvement of environmental protection requirements, solvent-free dipping varnishes are on the rise. Solvent-free dipping varnish has become a new important application field of epoxy resin. [0003] Harbin University of Science and Technology heated the epoxy resin to a certain temperature, and added a polymerization inhibitor, a certain proportion of styrene, oleic acid, self-made unsaturated polyester, accelerator, initiator, and xylene resin, Liquid acid, etc., fully mixed and filtered to obtain a one-component solvent-free impregnating varnish. The developed moisture-proof solvent-free insulating impregnating varnish has good moisture-proof and waterproof performance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08G59/20C08K3/36
Inventor 王峰王树森张小宾
Owner GOODE EIS SUZHOU CORP LTD