Additive for 4 micron carrier-free electrolytic copper foil, preparation method and application thereof

A technology of electrolytic copper foil and additives, applied in the direction of electrolysis, electroforming, etc., to achieve the effect of increasing crystal density, high tensile strength, and uniform thickness

Active Publication Date: 2017-01-18
安徽华威铜箔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, the technical bottleneck of preparing high-performance electrolytic copper foil, especially for ultra-thin copper foil s

Method used

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  • Additive for 4 micron carrier-free electrolytic copper foil, preparation method and application thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: The additive for the 4 micron carrier-free electrolytic copper foil provided in this embodiment includes the following raw material components in weight ratio:

[0029] Ethylenethiourea 10~15mg / L;

[0030] Hydroxyethyl cellulose 70~80mg / L;

[0031] Polyethylene glycol 45~55mg / L;

[0032] Potassium ethyldithiopropylcarbonate sulfonate 90~110mg / L;

[0033] N. Sodium N-dimethylthiohydrogenmethylacylpropane sulfonate 160~190mg / L.

[0034] Preferably, the ethylene thiourea, hydroxyethyl cellulose, polyethylene glycol, potassium ethyl dithiopropyl carbonate sulfonate, N.N-dimethylthiohydrogen methyl acyl propane sodium The weight ratio is 12.5:75:50:100:175 mg / L. That is, in every liter of additives, the ethylenethiourea, hydroxyethyl cellulose, polyethylene glycol, potassium ethyldithiocarbonate sulfonate, N.N-dimethylthiohydrogen methylacyl propane sulfonate The weight ratio of sodium bicarbonate is 12.5:75:50:100:175mg.

[0035] The preparation method o...

Embodiment 2

[0042] Embodiment 2: The additive for a 4 micron carrier-free electrolytic copper foil provided in this embodiment includes the raw material components in the following weight ratio:

[0043] Ethylenethiourea 15mg / L;

[0044] Hydroxyethyl cellulose 80mg / L;

[0045] Polyethylene glycol 55mg / L;

[0046] Potassium ethyl dithiopropyl carbonate sulfonate 110mg / L;

[0047] N. Sodium N-dimethylthiohydrogenmethylacylpropane sulfonate 190mg / L.

[0048] The preparation method of the additive for the 4 micron carrier-free electrolytic copper foil comprises the following steps:

[0049] (1) Weigh each raw material component according to the following weight ratio: 15 mg of ethylene thiourea; 80 mg of hydroxyethyl cellulose; 55 mg of polyethylene glycol; 110 mg of potassium ethyl dithiopropyl carbonate sulfonate; Sodium thiohydromethylacylpropane sulfonate 190mg;

[0050] (2) The ethylene thiourea, hydroxyethyl cellulose, polyethylene glycol, potassium propyl dithiocarbonate sulfonate...

Embodiment 3

[0052] Embodiment 3: A kind of additive for 4 micron unsupported electrolytic copper foil provided in this embodiment, it comprises the raw material component of following weight ratio:

[0053] Ethylenethiourea 10mg / L;

[0054] Hydroxyethyl cellulose 70mg / L;

[0055] Polyethylene glycol 45mg / L;

[0056] Potassium ethyl dithiopropyl carbonate sulfonate 90mg / L;

[0057] N. Sodium N-dimethylthiohydrogenmethylacylpropane sulfonate 160mg / L.

[0058] The preparation method of the additive for the 4 micron carrier-free electrolytic copper foil comprises the following steps:

[0059] (1) Weigh each raw material component according to the following weight ratio: ethylene thiourea 10 mg; hydroxyethyl cellulose 70 mg; polyethylene glycol 45 mg; Sodium thiohydromethylacylpropane sulfonate 160mg;

[0060] (2) The ethylene thiourea, hydroxyethyl cellulose, polyethylene glycol, potassium propyl dithiocarbonate sulfonate, and N.N-dimethylthiohydrogen methyl that were weighed in step (1)...

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Abstract

The invention discloses an additive for a 4-micrometre carrier-free electrolytic copper foil. The additive comprises the following raw material components by weight: 10-15mg/L ethylene thiourea; 70-80mg/L hydroxyethyl cellulose; 45-55mg/L polyethylene glycol; 90-110mg/L propyl ethyldithiocarbonate potassium sulfonate; and 160-190mg/L N.N-dimethylthio argonmethylacyl propanesulfonate sodium. The invention also discloses a preparation method and application of the additive. The additive for a 4-micrometre carrier-free electrolytic copper foil can reduce the rough surface roughness of the electrolytic copper foil, increase the crystallization density of crystal grains, and increase the tensile strength and peel strength. Through reasonable adding of the additive, the prepared copper foil can have a weight per unit area of 34-38g/mm<2>, a room temperature tensile strength of greater than or equal to 30Kg/mm<2>, a room temperature elongation of greater than or equal to 3%, a high temperature tensile strength of greater than or equal to 20Kg/mm<2>, a high temperature elongation of greater than or equal to 4%, surface roughness Ra of smaller than or equal to 0.3 micrometre and Rz of 0.6-1.0 micrometre.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper manufacturing, in particular to an additive, a preparation method and an application thereof for preparing an electrolytic copper foil of a 4-micron lithium-ion battery negative electrode collector. Background technique [0002] As an electronic basic material, electrolytic copper foil is mainly used on printed circuit boards (PCBs). However, with the successful development of lithium-ion batteries by Sony in the early 1990s, another use of electrolytic copper foil is lithium-ion negative electrode current collectors. Lithium-ion batteries are mainly used in electronic products such as notebook computers, mobile phones, digital cameras, and MP3 players. [0003] At present, lithium batteries have gradually expanded to the fields of electric bicycles and electric vehicles. The development of new energy vehicles has been mentioned to an unprecedented height by various countries. The thi...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 陈韶明
Owner 安徽华威铜箔科技有限公司
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