Nano hybrid material modified organosilicone heat-conductive electronic pouring sealant and preparation method of sealant

Abstract

The invention relates to a nano hybrid material modified organosilicone heat-conductive electronic pouring sealant for an electronic product and a preparation method of the sealant. The preparation method comprises the following steps: adding vinyl polydimethylsiloxane, an organosilicone nano hybrid material and surface modified heat-conductive filler into a vacuum kneading machine, and dehydrating and blending for 50-100 minutes to obtain a base material at the temperature of 100-145 DEG C and the vacuum degree of (-0.07)-(-0.09)MPa; adding a hydrogen containing silicone oil crosslinking agent and a crosslinking inhibitor into the base material at the normal temperature, and fully stirring for 20-40 minutes to prepare a component A; adding a platinum catalyst into the base material, and fully stirring for 20-40 minutes to prepare a component B; and then uniformly blending the components A and B in equal weight, and defoaming for 6-12 minutes at the vacuum degree of 0.05-0.07MPa to obtain the nano modified organosilicone heat-conductive electronic pouring sealant. The pouring sealant has relatively low viscosity and good mobility. The heat conductivity coefficient is 0.6-0.85w/m.k. The cured product has good mechanical performance and electrical performance and can be cured at the normal temperature or the high temperature. The pouring sealant can be widely applied to packaging electronic elements, integrated circuit boards, circuit modules, LED (Light Emitting Diode) chips and the like.

Description

[0001] The invention relates to an organosilicon heat-conducting potting glue modified by a nano-hybrid material for electronic products and a preparation method thereof. Add vinyl polydimethylsiloxane, silicone nano-hybrid materials, and surface-modified thermally conductive fillers into a vacuum kneader, dehydrate and blend at a temperature of 100-145°C and a vacuum of -0.07 to -0.09MPa for 50 - 100 minutes to get the base. At room temperature, add hydrogen-containing silicone oil cross-linking agent and cross-linking inhibitor to the base material, stir well for 20-40 minutes to make component A; add platinum catalyst to the base material, stir well for 20-40 minutes to make component B. Then take equal weight parts of component A and component B and blend them evenly, and defoam for 6-12 minutes at a vacuum degree of 0.05-0.07 MPa to obtain a nano-modified silicone heat-conducting potting compound. The encapsulant has low viscosity, good fluidity, thermal conductivity of 0....

AI Technical Summary

Problems solved by technology

However, in order to obtain electronic potting materials with better thermal conductivity, a large amount of filling and modification of silicone rubber is required, which greatly increases the viscosity of electronic potting materials and affects its fluidity and mechanical properties.

Such as Chinese patent application CN101054057A discloses a kind of high thermal conductivity silicone potting glue, CN101407635A discloses a kind of addition type heat conductive silicone rubber with higher thermal conductivity, but its fluidity is not good enough; Flame-retardant liquid silicone rubber, although the silicone rubber has high thermal conductivity and flame-retardant properties, but because of its viscosity above 10000mPa·s, the fluidity is not good, so it is not suitable for electronic potting glue

Chinese patent: 200810035243.3, which discloses a nano heat-conducting transparent potting compound material and its preparation method, but also has the problem of insufficient fluidity

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