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Water-based conductive adhesive and preparation method thereof

An adhesive and water-based technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of poor adhesion of conductive adhesives

Inactive Publication Date: 2014-06-18
CHANGCHUN SANHUA IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of poor cohesiveness of existing conductive adhesives, and to provide a green environmental protection water-based conductive adhesive and its preparation method

Method used

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  • Water-based conductive adhesive and preparation method thereof

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preparation example Construction

[0029] The present invention also provides a kind of preparation method of water-based conductive adhesive, comprising the following steps:

[0030] In terms of parts by mass, mix water-based polyurethane emulsion, poly-3,4-ethylenedioxythiophene-polystyrenesulfonic acid, talcum powder, coupling agent, water-based leveling agent and organic bentonite, and sand mill for 1.5 to 3 minutes after stirring. hours, the stirring speed is preferably 1500-3000rpm, more preferably 2000rpm, then add water-based curing agent and water-based film-forming aid, stir and filter, the stirring speed is preferably 1800-3000rpm, more preferably 2600rpm, stirring The time is preferably 20-35 minutes to obtain a water-based conductive adhesive.

[0031] The obtained water-based conductive adhesive is sprayed on the ABS plastic substrate and PET non-woven fabric, and the spraying amount is 160g / m 2 , dried at 80°C for 2 minutes, and then bonded and tested for peeling force. Coat the conductive glue...

Embodiment 1

[0035] 48g of water-based polyurethane emulsion Sancure12954, 3g of poly 3,4-ethylenedioxythiophene-polystyrenesulfonic acid (conductivity 1.0×10 4 ohm / m 2 , with a molecular weight of 8000 Daltons), 1g of talc powder (1280 mesh), 3g of coupling agent KH-550, 0.15g of water-based leveling agent BYK-380 and 0.08g of Hemings Bentone38 organic bentonite, and stir After sanding for 1.5 hours, the stirring speed was 2000rpm;

[0036]Under stirring conditions, add 2.4g of water-based curing agent Bayhydur3100, 5g of water-based film-forming aid ethylene glycol butyl ether, and filter after 20 minutes of high stirring. The stirring speed is 2500rpm to obtain a water-based conductive adhesive.

[0037] The water-based conductive adhesive that embodiment 1 obtains is sprayed on the ABS plastic substrate and the PET non-woven fabric, and the spraying amount is 160g / m 2 , dried at 80°C for 2 minutes, then bonded, and tested for peeling force, the peeling force was 85N / cm; coated the co...

Embodiment 2

[0039] 75g of water-based polyurethane emulsion Sancure2026, 7g of poly 3,4-ethylenedioxythiophene-polystyrenesulfonic acid (conductivity 1.0×10 5 ohm / m 2 , with a molecular weight of 14000 Daltons), 5g of talc powder (1280 mesh), 8g of coupling agent KH560, 0.42g of water-based leveling agent BYK-307 and 0.17g of Hemings Bentone38 organic bentonite, and sand after stirring Grinding for 3 hours, the stirring speed is 1800rpm;

[0040] Under stirring conditions, 5.2 g of water-based curing agent Bayhydur XP2547 and 12 g of water-based film-forming aid diethylene glycol butyl ether were added, and then filtered after high stirring for 35 minutes. The stirring speed was 2600 rpm to obtain a water-based conductive adhesive.

[0041] The water-based conductive adhesive obtained in embodiment 2 is sprayed on the ABS plastic substrate and PET non-woven fabric, and the spraying amount is 160g / m 2 , dried at 80°C for 2 minutes, then bonded and tested for peeling force, the peeling fo...

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Abstract

The invention provides a water-based conductive adhesive and a preparation method of the adhesive, which belong to the technical field of adhesives and aim at solving the problem of poor adhesion performance of the existing conductive adhesive. The water-based conductive adhesive contains the following components in parts by mass: 48-75 parts of water-based polyurethane emulsion, 3-7 parts of poly-3,4-ethylenedioxythiophene-polystyrolsulfon acid, 1-5 parts of talcum powder, 3-8 parts of a coupling agent, 2.4-5.2 parts of a water-based curing agent, 0.15-0.42 part of a leveling agent, 5-12 parts of a water-based film-forming additive and 0.08-0.17 part of organic bentonite. The invention also provides the preparation method of the water-based conductive adhesive. The water-based conductive adhesive does not contain any volatile 'tribenzyl' substance and consequently does not cause any pollution to environment, and the stripping resistance of the water-based conductive adhesive can achieve 110N / cm.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a water-based conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. The usual preparation method is to use matrix resin and curing agent as film-forming substances, conductive fillers as conductive additives, and combine conductive particles through the bonding effect of matrix resin. Form a conductive network channel to realize the conductive connection of the bonded materials. The main components of conductive adhesives are matrix resin, curing agent, conductive additives and auxiliary agents. So far, conductive fillers mostly use non-polar materials such as conductive carbon black, conductive graphite, graphene and metal powder as conductive additives. Patent 201110246296.1 reports a preparation method of a conductive adhesive, using epoxy resin as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J165/00C09J125/18C09J9/02C09J11/04C09J11/06
Inventor 张振久张恩綦马海松周宇飞蒋舰
Owner CHANGCHUN SANHUA IND