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Texturing method of solar cells

A solar cell, radio frequency voltage technology, applied in chemical instruments and methods, circuits, discharge tubes, etc.

Inactive Publication Date: 2014-06-18
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to simultaneous gas input, simultaneous etching and sidewall formation effects cancel each other out

Method used

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  • Texturing method of solar cells
  • Texturing method of solar cells
  • Texturing method of solar cells

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Embodiment Construction

[0024] The specific embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0025] figure 1 is a schematic diagram of the structure of the plasma processing chamber. As shown in the figure, the plasma processing chamber 100 has a cavity body 102, the cavity body 102 is substantially cylindrical, and the side walls of the cavity body are substantially vertical, and the upper electrode 109 and the lower electrode 109 arranged parallel to each other are arranged in the cavity body 102. electrode 106 . Generally, the region between the upper electrode 109 and the lower electrode 106 is the process region P, where the RF power source 104 connected to the lower electrode 106 generates high frequency energy to ignite and maintain plasma. A substrate W to be processed is placed above the lower electrode 106 . The reaction gas is input into the processing chamber 102 from the gas source 103, and one or more radio frequency power ...

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Abstract

The invention provides a texturing method of solar cells. A substrate is placed in a plasma processing chamber for a manufacturing process. The texturing method comprises: a reaction gas and a side wall protection gas are introduced into the chamber; and etching on the substrate and side wall protection are carried out at the same time, and a pulsed bias RF voltage is applied during the above manufacturing process to form a textured surface. With the method, a better textured surface can be formed.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a texture method for solar cells. Background technique [0002] At present, in the process of making solar cells, the silicon wafer is usually placed on the lower electrode of the reaction chamber of the capacitively coupled plasma processing chamber, and the reaction will be introduced by forming an electric field between the lower electrode or the corresponding upper electrode. The reactive gas of the chamber is ionized to form its plasma. Alternatively, several coils are arranged outside the top plate of the reaction chamber of the inductively coupled plasma processing chamber, and an induced electric field is generated after an alternating current is passed through to dissociate the introduced reaction gas to form its plasma. [0003] The silicon wafer is textured by the plasma of the reactive gas, that is, the damage on the surface of the silicon wafer due to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18C30B33/12
CPCH01J37/32082H01J37/32146H01L31/02363Y02E10/50Y02P70/50
Inventor 王兆祥邱达燕倪图强苏兴才
Owner ADVANCED MICRO FAB EQUIP INC CHINA