Low-surface energy polyamide 66 engineering plastic and preparation method thereof

An engineering plastics, low surface energy technology, applied in the field of composite materials, can solve the problems of high cost, reduce the surface energy of PA66 materials, unfavorable material promotion and application, etc., to achieve the effect of low production cost, meet market demand, and low price

Inactive Publication Date: 2014-07-09
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The methods proposed in the above two documents can effectively reduce the surface energy of PA66 materials, but the cost of fluorine-containing low-molecular-weight amphiphi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Weigh 87 parts of polyhexamethylene adipate, 10 parts of red phosphorus flame retardant, 1 part of 3.5 hydrated zinc borate, 1 part of zinc oxide, and 20% by mass of ethylene-vinyl acetate copolymer Compound (EVA) is 1 part of the silicone masterbatch of carrier, mixes evenly in high-speed mixer;

[0030] (2) Extrude and granulate the homogeneously mixed materials in (1) in a twin-screw extruder to obtain low surface energy polyamide 66 engineering plastics, and the temperature of each zone of the twin-screw extruder is 220-280°C .

[0031]

Embodiment 2

[0033] (1) Weigh 59 parts of polyhexamethylene adipate, 25 parts of talc powder, 10 parts of red phosphorus flame retardant, 2 parts of 3.5 hydrated zinc borate, 2 parts of zinc oxide, 30% by mass 2 parts of silicone masterbatches with polyethylene (PE) as the carrier, mixed evenly in a high-speed mixer;

[0034] (2) Extrude and granulate the homogeneously mixed materials in (1) in a twin-screw extruder to obtain low surface energy polyamide 66 engineering plastics, and the temperature of each zone of the twin-screw extruder is 220-280°C .

[0035]

Embodiment 3

[0037] (1) Weigh 45 parts of polyhexamethylene adipate, 35 parts of wollastonite, 20 parts of red phosphorus flame retardant, 3 parts of anhydrous zinc borate, 5 parts of zinc oxide according to the weight ratio, and the mass percentage is 40% The ethylene-vinyl acetate copolymer (EVA) is 3 parts of the silicone masterbatch of carrier, mixes homogeneously in high-speed mixer;

[0038] (2) Extrude and granulate the homogeneously mixed materials in (1) in a twin-screw extruder to obtain low surface energy polyamide 66 engineering plastics, and the temperature of each zone of the twin-screw extruder is 220-280°C .

[0039]

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PUM

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Abstract

The invention provides a low-surface energy polyamide 66 engineering plastic and a preparation method thereof. The preparation method comprises the following steps: mixing and extruding 30-90 parts of polyhexamethylene adipamide, 0-40 parts of filling modifier, 10-30 parts of red phosphorus flame retardant, 1-5 parts of zinc borate, 1-5 parts of zinc oxide and 1-5 parts of silicone master batch to prepare the plastic. The silicone master batch is introduced into a PA66 system, the surface energy of the PA66 material can be well reduced, the tin adhesion resistance of the material is improved, and an application of the PA66 material in aspects of electronic electric appliance engineering plastic products is widened. Meanwhile, the production cost is relatively low, and the market requirements can be met.

Description

technical field [0001] The invention belongs to the field of composite materials, and in particular relates to a low surface energy polyamide 66 engineering plastic and a preparation method thereof. [0002] Background technique [0003] Polyamide (PA), commonly known as nylon, is the non-metallic material with the longest history, excellent comprehensive performance, largest output and most widely used in engineering plastics. It has wear resistance, impact resistance, fatigue resistance, oil resistance, corrosion resistance and Wide temperature range and other advantages. There are many varieties of PA, among which PA6 and PA66 are dominant. PA66 is widely used in electronic and electrical engineering plastic parts, such as connectors in computers. However, such as computer internal connectors need to be in contact with molten solder, because PA66 has a high surface energy due to its high polarity, and the surface area of ​​molten solder is large, so that molten sold...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L83/04C08K3/00C08K3/02C08K3/34C08K3/38C08K3/22B29B9/06
CPCC08L77/06C08J3/226C08J2377/06C08J2423/06C08J2423/08C08J2483/04C08L2205/03C08L83/04C08L23/0853C08K2003/026C08K3/38C08K2003/2296C08L23/06C08K3/34
Inventor 杨桂生俞建
Owner HEFEI GENIUS NEW MATERIALS
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