high power led light engine

Abstract

A high-power LED light engine comprising an LED light source (41), a metal substrate (10), a power driver module (42), and a rectifier module (43). Multiple resin insulating modules (20) and multiple high thermal-conductivity insulating layers (30) are formed on the metal substrate (10). A metal pattern circuit is formed on the resin insulating layers (20). The LED light source (41), the power driver module (42), and the rectifier module (43) are formed on the high thermal-conductivity insulating layer (30). Arranged on the metal substrate (10) are the insulating layers of different thermal conductivities and different materials that can be configured and distributed on the basis of the position, size, and power of the LED light source (41) and of those of the rectifier module (43), thus allowing implementation of optimized heat dissipation. Integral arrangement of the LED light source (41) and of the rectifier module (43) on a same substrate (10) not only implements optoelectronic integration but also facilitates overall light source efficiency while increasing reliability.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting, and more specifically, the invention relates to a high-power LED light engine that facilitates high-efficiency heat dissipation. Background technique [0002] Due to the superior characteristics of light-emitting diodes such as low power consumption, high energy conversion efficiency, long life and no mercury pollution, light-emitting diodes have become the first choice to replace traditional lighting. advantage and has achieved unprecedented development. High-power LED solid-state lighting is the most important lighting revolution since the invention of incandescent lamps. It has the biggest difference from traditional lighting sources, high luminous efficiency, and energy consumption is only one-eighth of ordinary incandescent lamps; it has been widely used in street lighting , industrial and mining and public places, etc. [0003] With the increase of LED current intensity and...

AI Technical Summary

Problems solved by technology

With the continuous improvement of the current LED packaging level, there are more and more large-size chips and multi-chip packages, and the power consumption is getting higher and higher, which puts forward higher heat dissipation requirements for the carrier substrate. The existing metal-based printed circuit boards are used in applications There have been many problems in the LED display, one of the main reasons is that the LED fails due to insufficient heat dissipation.

During the use of LED, 70-90% of the energy consumption will be converted into heat energy. If the heat cannot be dissipated in time, the temperature of the LED will be too high, resulting in a decrease in luminous efficiency and a reduction in the life of the LED. In severe cases, it may be directly burned chip

[0005] In order to increase the power load of the metal substrate, reduce the volume, prolong the life, increase the output power and increase the reliability, a trend in the development of LED lamps is to integrate the LED chip and the driving power module on one substrate, but integrate the components on one substrate. Although it is theoretically beneficial to increase the integration density, luminous efficiency and increase the total brightness, it also exacerbates the problem of heat dissipation and becomes a bottleneck restricting the development of LED lighting technology.

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