Brazing method for graphite-copper composite commutator
A brazing method and commutator technology, applied in commutator manufacturing, circuit/collector components, electrical components, etc., can solve the problem of reducing the performance of graphite-copper composite structure commutators, graphite and copper commutator blades Problems such as falling off and affecting product quality can be achieved to achieve the effect of improving performance, low cost and stable process
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Embodiment 1
[0013] Embodiment 1: the steps of this embodiment are as follows: (1) material preparation: SnAgCuTi powder brazing filler metal is made up of Sn powder of 50~98.5%, the Ag powder of 0.5~20%, the Cu powder of 0.5~20% and 0.5~ It is composed of 10% Ti powder, and the powder brazing material used is composed of metal element, the mass purity is 99~99.95%, and the particle size is 10~100μm. (2) Ball milling: Put the weighed Sn powder, Ag powder, Cu powder and Ti powder into the ball mill tank together, the ball-material ratio is 10~16︰1, the filler ratio is 45%~55%; after vacuuming, fill Inject argon, and then perform intermittent ball milling for 1-4 hours at a rotational speed of 150-250r / min; take out the balls after ball milling. (3) Metallization: Coat the prepared SnAgCuTi powder on the surface of the graphite disc with a thickness of 0.005~0.5mm and place it in 10 -2 ~10 -4 Under Pa vacuum condition, heat to 450°C~900°C, keep warm for 0~60min to obtain metallized layer, ...
Embodiment 2
[0014] Example 2: The difference between this embodiment and specific embodiment 1 is that in step (1), the SnAgCuTi powder solder is composed of 90% Sn powder, 3% Ag powder, 3% Cu powder, and 4% Ti powder by weight percentage , the other steps are the same as in the first embodiment.
Embodiment 3
[0015] Example 3: The difference between this embodiment and the second embodiment is that the thickness of the SnAgCuTi powder solder coated on the surface of the graphite disc in step (3) is 0.1mm, and other steps are the same as the second embodiment.
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