American window solder and seamless welding method using same

Abstract

The invention discloses American window solder. The American window solder is made with, by weight, 4.5-6% of silicon, 0.1-0.3% of antimony, 20-23% of copper, 2.5-4% of nickel, 0.5-0.72% of lithium, 0.15-0.3% of bismuth, 0.1-0.15% of silver, 0.2-0.4% of boron, and the balance of aluminum. The invention further discloses a seamless welding method using the American window solder. The seamless welding method includes: polishing the surface of a part to be welded so as to remove a surface oxide film; polishing the polished weld break to obtain a slope; cleaning the part to be welded, with pickling passivating solution; welding the part to be welded, with the American window solder; cleaning the welded part with water-soluble cleaner. The American window solder is low in soldering temperature, good in heat resisting cycling performance, good in wear resistance and corrosion resistance and excellent in mechanical properties.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to an American window solder and a seamless welding method thereof. Background technique [0002] Solder is a general term for metal alloy materials used to add to welds, overlays and brazes. The main function of solder is to connect the objects to be soldered and form a channel for the circuit. Commonly used soldering tin has the following conditions: the melting point of the solder is lower than that of the workpiece to be welded, it is easy to integrate with the workpiece to be welded, it has a certain resistance to pressure, it must have better electrical conductivity and a faster crystallization speed. However, in recent years, awareness of environmental protection has increased, and RoHS regulations have regulated lead, which has restricted the use of lead-containing Pb-Sn solder, and began to use so-called "lead-free solder" that does not contain lead. The currently used Sn-...

AI Technical Summary

Problems solved by technology

However, in recent years, environmental protection awareness has increased, and the RoHS regulations have regulated lead, which has restricted the use of lead-containing Pb-Sn solder, and began to use so-called "lead-free solder" that does not contain lead.

The currently used Sn-Ag-Cu solder alloy is used as lead-free solder. Although the scope of application of lead-free solder alloy is expanding, its solder joints are prone to breakage and deterioration in some environments.

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