Hot melt pressure-sensitive adhesive

Abstract

The invention relates to a hot melt pressure-sensitive adhesive, and particularly relates to a hot melt pressure-sensitive adhesive which can be especially applicable to fixed sealing of display screens of hand-held electronic devices such as mobile telephones, tablet computers and the like and for example preparation of door / window sealing rubber strips. The hot melt pressure-sensitive adhesive mainly comprises 100 parts of methyl methacrylate and butyl acrylate copolymer, 1-20 parts of butadiene-styrene random copolymer, 50-350 parts of tackifier (pentalyn or petroleum resin), 10-100 parts of naphthenic oil and 5-100 parts of fluid rubber. The hot melt pressure-sensitive adhesive provided by the invention has high permanent viscous force and release force, can resist a high-low temperature difference from -30 DEG C to 85 DEG C, and is favorable in sealing effect; the hot melt pressure-sensitive adhesive is applicable to a wide range of surfaces, is particularly applicable to fixing of display screens of electronic devices and brackets of electronic components, and can also achieve favorable process effect when being used in the aspects of preparation of door / window sealing rubber strips and the like; and the hot melt pressure-sensitive adhesive is simple in preparation process, has low requirements for process and devices, and is suitable for popularization and production.

Description

technical field [0001] The invention relates to a hot-melt pressure-sensitive adhesive, in particular to a hot-melt pressure-sensitive adhesive that can be simultaneously applied to the fields of fixing and sealing display screens of handheld electronic devices such as mobile phones and tablet computers, and preparing door and window sealing strips. technical background [0002] With the rapid development of the electronics industry, electronic equipment is developing in the direction of miniaturization, high capacity and high performance. High integration and ultra-thin electronic components have become a trend, especially with the integration of precision and closed With the popularization of circuits, the protection requirements for electronic products are getting higher and higher. Specifically, the application environment of integrated circuits is becoming more and more harsh. Good thermal sealing effect. The existing electronic components fix the display screen and t...

AI Technical Summary

Problems solved by technology

The existing electronic components fix the display screen and the bracket by fixing the display screen on the bracket with double-sided tape, but because ordinary double-sided tape cannot achieve the required fixing effect, it is generally necessary to use a The four corners of the screen are fixed on the bracket with a polyurethane reactive hot melt adhesive, which brings a disadvantage. When the electronic components, especially the display screens of mobile phones and tablet computers, are broken and need to be replaced In order to separate the screen from the bracket, the fixing part of the bracket and the screen must be destroyed. This separation method often destroys the bracket of the mobile phone at the same time, so the cost of replacing the screen of the existing electronic components is almost always to replace the bracket and the bracket at the same time. display screens, resulting in very expensive replacement displays

The use of ordinary double-sided tape to fix the display screen and bracket does not have good peeling force and holding force, and cannot meet the fixing requirements

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