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A kind of preparation method of uniform gold-tin eutectic alloy foil

A technology of eutectic alloy and uniform structure, which is applied in the field of metal material preparation to achieve the effect of reducing production cost, uniform deformation and stress of welding piece, and good welding performance

Active Publication Date: 2016-01-20
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defects of the existing difficult-to-deform metal precision foil processing technology, and provide a gold-tin eutectic alloy with a uniform microstructure, accurate composition, good welding performance, and a thickness of 0.1mm-0.2mm. Method of making the foil

Method used

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  • A kind of preparation method of uniform gold-tin eutectic alloy foil
  • A kind of preparation method of uniform gold-tin eutectic alloy foil
  • A kind of preparation method of uniform gold-tin eutectic alloy foil

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Effect test

Embodiment 1

[0032] Precisely configure the gold-tin eutectic alloy whose composition is 20% by mass of tin and 80% by mass of gold. Air in the body, and then evacuate until the vacuum degree reaches 10 -3 After Pa, under the working current of 900A, the arc is smelted, the smelting peak temperature is 1300 ℃, and the gold-tin alloy melt is obtained, and the melt is electromagnetically stirred, and the electromagnetic stirring speed is 1100r / min, and the stirring time is 1-2 minutes. Then, use Cool the water-cooled copper crucible to room temperature, and control the cooling rate to 1.0-1.1*10 3 K / min; repeat the process of smelting, stirring, and cooling 4 times; take out the ingot and hold it at 240°C for 2 hours. After homogenizing annealing, the ingot is then thermally compressed at 240°C. The pressure is 0.02mm / s, the holding time is 2 minutes, the deformation of each pass is controlled at 17-19%, annealing is performed at 240-260°C between passes, the annealing holding time is 10 mi...

Embodiment 2

[0035] Precisely configure the gold-tin eutectic alloy whose composition is 20% by mass of tin and 80% by mass of gold. Air in the body, and then evacuate until the vacuum degree reaches 10 -3After Pa, under the working current of 950A, the arc is smelted, the smelting peak temperature is 1300 ℃, and the gold-tin alloy melt is obtained, and the melt is electromagnetically stirred, and the electromagnetic stirring speed is 1300r / min, and the stirring time is 1-2 minutes. Then, use The water-cooled copper crucible is cooled to room temperature, and the cooling rate is controlled to be 1.2-1.3*10 3 K / min; repeat the process of smelting, stirring, and cooling 5 times; take out the ingot and hold it at 250°C for 3 hours. After homogenizing annealing, the ingot is then thermally compressed at 250°C. The pressure is 0.01mm / s, the holding time is 2 minutes, the deformation of each pass is controlled at 16-18%, annealing is performed at 240-260°C between passes, the annealing holding ...

Embodiment 3

[0038] Precisely configure the gold-tin eutectic alloy whose composition is 20% by mass of tin and 80% by mass of gold. Air in the body, and then evacuate until the vacuum degree reaches 10 -3 After Pa, arc melting under the working current of 1000A, the melting peak temperature is 1300 ℃, and the gold-tin alloy melt is obtained, and the melt is electromagnetically stirred, and the electromagnetic stirring speed is 1500r / min, and the stirring time is 1-2 minutes. Then, use Cool the water-cooled copper crucible to room temperature, and control the cooling rate to 1.4-1.5*10 3 K / min; repeat the process of smelting, stirring and cooling 6 times; the solidified structure after smelting is as follows figure 1 As shown, it is a full-sheet lamellar eutectic structure without primary phase; the ingot is taken out and kept at 260°C for 5 hours for homogenization annealing. The microstructure of the ingot after homogenization heat treatment is as follows: figure 2 As shown, it is an ...

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Abstract

The invention relates to a preparation method for a gold-tin eutectic alloy foil having a uniform structure. The preparation method comprises: accurately preparing a gold-tin alloy raw material with a tin mass percentage of 20% and a gold mass percentage of 80%; in a non-consumable electrical arc smelting furnace, under a vacuum degree of 10<-3> Pa, repeatedly carrying out smelting, electromagnetic stirring and cooling at least three times to obtain a gold-tin alloy casting ingot; and carrying out homogenization annealing on the casting ingot, and then carrying out multi-pass thermal compression to obtain the gold-tin eutectic foil. According to the present invention, the vacuum electrical arc smelting, the circular electromagnetic stirring and the cyclic thermal compression to prepare the whole lamellar eutectic structure, wherein the eutectic point component does not have the primary phase; and compared with the preparation method in the prior art, the preparation method of the prevent invention has the following characteristics that: the complete alloying is achieved, the strength is high, the weldability is good, other components are not added or the gold-to-tin ratio is not adjusted, the welding temperature and the welding performance are stable, the welding piece deformation and the force on the welding piece are uniform, the welding piece cracking condition is not easily generated, the yield is high, the production efficiency is much higher than the production efficiency of the electroplating method for preparing the gold-tin welding piece, the production cost is reduced, and the preparation method is suitable for mass production.

Description

technical field [0001] The invention relates to a processing technology of a difficult-to-deform alloy foil, in particular to a preparation method of a gold-tin eutectic alloy foil with uniform structure. The invention belongs to the technical field of metal material preparation. Background technique [0002] For a long time, tin-lead solder has been widely used in electronic packaging. In recent years, due to the increasing health and environmental protection and the improvement of the reliability of solder joints in modern high-power electronic and optoelectronic devices, there is an urgent need for solder with high creep resistance and good thermal fatigue resistance. Au80Sn20 alloy solder with a melting point of 280°C has excellent properties such as high strength, high thermal conductivity, and flux-free. It is an ideal material to replace traditional tin-lead solder, especially in high-reliability circuit packaging and chip soldering. It has received extensive attenti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/02C22F1/14C22C1/02B22D27/02
Inventor 马运柱黄宇峰刘文胜王依锴汤娅
Owner CENT SOUTH UNIV
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