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A method for quickly connecting activated metal surfaces and micro-nano connection materials at low temperature

A connection material and quick connection technology, applied in nanotechnology, metal processing equipment, metal processing mechanical parts, etc., can solve the problems of interface defects, long connection time and high connection temperature of micro-connection technology, and achieve fewer defects and reduce connection. The effect of simple process temperature and process flow

Inactive Publication Date: 2016-08-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of long connection time, high connection temperature and defective interface of the existing micro-connection technology, and provide a method for quickly connecting activated metal surfaces and micro-nano connection materials at low temperature

Method used

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  • A method for quickly connecting activated metal surfaces and micro-nano connection materials at low temperature
  • A method for quickly connecting activated metal surfaces and micro-nano connection materials at low temperature

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specific Embodiment approach 1

[0018] Specific Embodiment 1: In this embodiment, the method for quickly connecting the activated metal surface and the micro-nano connecting material at a low temperature is carried out according to the following steps:

[0019] 1. Select the substrate material to be surface activated;

[0020] 2. Use surface technology to prepare metal micro-nano structures on the surface of the substrate, and then cover the metal micro-nano structures with a gold layer, and control the thickness of the gold layer to 0.05 μm to 0.10 μm;

[0021] 3. Select micro-nano connecting materials with a diameter of 10nm-20μm as solder;

[0022] 4. Apply micro-nano connecting material on the surface of the substrate treated in step 2, then take the substrate treated in step 2, and bond the two substrates, thereby completing the vertical interconnection of the two substrate stacks.

[0023] The beneficial effect of this implementation mode:

[0024] The advantages and positive effects of this embodime...

specific Embodiment approach 2

[0025] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the substrate material in step 1 is copper, iron, copper alloy, iron alloy or silicon wafer. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0026] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the surface technology described in step two is screen printing, magnetron sputtering, chemical vapor deposition, chemical deposition or template electrodeposition, and control The micro-nano structure has a height of 0.2 μm to 2.0 μm, a particle diameter of 50 nm to 200 nm, and a thickness of 2 μm to 8 μm. Others are the same as in the first or second embodiment.

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Abstract

The invention provides a method for rapidly connecting the activated metal surface and micro-nano connection material at low temperature, and relates to a method for nanometer micro connection. The method aims to solve the problems that connection time is long, connection temperature is high and the interface has defects in the existing micro connection technique. The method comprises the steps that firstly, material of a substrate is selected; secondly, a metal micro-nano structure is prepared; thirdly, micro-nano connection material is selected; fourthly, bonding is performed. Compared with traditional fusion welding, connection efficiency is remarkably improved, the connection time is shortened, the connection technology temperature is reduced, scaling powder is not needed, bonding residual stress is small, the number of the defects like micro holes in the interfaces is reduced, and the technology process is simple and short in consumed time. The method is used for rapidly connecting the activated metal surface and the micro-nano connection material at the low temperature.

Description

technical field [0001] The invention relates to a nano-micro connection method, in particular to a method for quickly connecting activated metal surfaces and micro-nano connection materials at low temperature, so as to realize the interconnection and bonding of different components in a solid state. Background technique [0002] The technology of nano-micro connection is constantly innovating. The traditional fusion bonding technology is to control the temperature to make the metal at the bonding point melt and wet the two sides of the bonding point. After cooling, the bonding point solidifies, so as to obtain good welding. At present, aerospace, energy and other important departments related to the national economy and people's livelihood have an increasing demand for high-power integrated electronic devices, and correspondingly, the requirements for packaging technology of service devices are also getting higher and higher. In order to better solve this problem, researcher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603B81C3/00B82Y40/00
Inventor 郑振周炜王春青
Owner HARBIN INST OF TECH
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