Heat sink for electronic device based on solid adsorption driving and enhanced heat pipe heat transfer

Abstract

The invention discloses a heat sink for an electronic device based on solid adsorption driving and enhanced heat pipe heat transfer. The heat sink for the electronic device based on the solid adsorption driving and the enhanced heat pipe heat transfer comprises an evaporator, an adsorption bed, a condenser, an expansion valve, a hot water system and a cooling water system, wherein the hot water system comprises a hot water tank and a heat exchanger; the cooling water system comprises a cooling water tank, a condenser and a cooling tower; an evaporation panel is arranged at the bottom of the evaporator, the lower surface of the evaporation panel can be buckled on a heating piece of the electronic device, a heat pipe group is arranged inside the evaporator, the evaporator is respectively connected with the adsorption bed and the expansion valve, and the other end of the expansion valve is connected with the condenser; the adsorption bed is respectively connected with the cooling water tank, the hot water tank, the cooling tower, the heat exchanger and the condenser by virtue of pipelines, a hot water pump is arranged on a pipeline between the adsorption bed and the hot water tank, and a cooling water pump is arranged on the pipeline between the adsorption bed and the cooling water tank. The heat sink for the electronic device based on the solid adsorption driving and the enhanced heat pipe heat transfer has the advantages of high energy utilization rate, low requirement on temperature of driving heat source, easiness for control and the like.

Description

technical field [0001] The invention relates to a low-grade heat source utilization technology and an electronic device radiator, in particular to an electronic device radiator based on solid adsorption drive and heat pipe enhanced heat transfer. Background technique [0002] At present, the electronics industry in my country is developing rapidly. With the high frequency and high speed of electronic devices and the advancement of integrated circuit technology, the performance of electronic devices is getting higher and higher, which makes the heat generation and heat flux per unit volume of electronic devices increase significantly. Take electronic chips as an example, the current maximum heating power of electronic chips has exceeded 100w / cm 2 , and increasing rapidly, the layout and design of electronic heat sinks encounter more and more constraints. [0003] Commonly used traditional heat dissipation methods such as air cooling (forced convection), because its cooling ef...

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Problems solved by technology

[0006] As far as the condensation process is concerned, there are two deficiencies: (1) The condensation process relies on the sensible heat of cooling water to "neutralize" the latent heat of condensation of water vapor, and the efficiency is very low, and the quasi-equilibrium pressure of water vapor in the condensation process is relatively high, close to 8~ 50kPa, which reduces the superheat of the solution inlet and restricts the evaporation efficiency of the evaporation end; (2) Due to the temperature benchmark of the commonly used cooling water (the cooling water of the seawater desalination system mainly uses seawater, generally around 25°C, and the regeneration of the dehumidification solution uses a cooling tower Cooling water, generally around 32°C), the range of available low-grade heat sources is limited, for example, when using a 60°C solution for multi-stage flash regeneration, the temperature difference between the two is only 28°C, and the number of stages that can be set is limited

[0007] As far as the solution flash evaporation process is concerned, there are two disadvantages: (1) This is a surface evaporation with a limited evaporation area; (2) With the continuous evaporation of water, the temperature of the main solution decreases rapidly, that is, the superheat decreases or even disappears. Its evaporative strength also decreases

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