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Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

一种切割胶带、胶粘剂的技术，应用在半导体/固态器件制造、薄膜/薄片状的粘合剂、胶粘剂等方向，能够解决焊盘污染、导电性下降、树脂糊剂厚度不均一等问题，达到防止热影响、抑制翘曲的效果

Inactive Publication Date: 2014-08-20
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the method using a resin paste has problems in that the conductivity is lowered due to voids, or the thickness of the resin paste is not uniform, and the pad is contaminated due to extrusion of the resin paste.

Method used

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  • Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
  • Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
  • Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3 and comparative example 1～3

[0134] According to the proportions described in Table 1, the components and solvent (methyl ethyl ketone) described in Table 1 were put into the stirring tank of a mixing mixer (HM-500 manufactured by KEYENCE), and stirred and mixed for 3 minutes in the stirring mode. The obtained varnish was applied to a release treatment film (MRA50 manufactured by Mitsubishi Plastics Co., Ltd.) with a slit coater, and then dried to obtain a film-like adhesive.

[0135] The obtained film adhesive was cut out into a circle with a diameter of 230 mm, and stuck to the adhesive layer of a dicing tape (P2130G manufactured by Nitto Denko Co., Ltd.) at 25°C to prepare a film adhesive. Cut the tape.

Embodiment 4～6 and comparative example 4～6

[0137] According to the proportions described in Table 2, put the ingredients described in Table 2 into the stirring tank of a planetary mixer (T.K.HIVIS MIX "P-03" manufactured by PRIMIX Co., Ltd.), and stir and mix at 90°C 20 minutes. Through a forming press (Kitagawa Seiki Co., Ltd. VH1-1572) at 120°C and a pressure of 1kg / cm 2 The resulting mixture is pressurized to form a film-like adhesive.

[0138] The obtained film adhesive was cut out into a circle with a diameter of 230 mm, and stuck to the adhesive layer of a dicing tape (P2130G manufactured by Nitto Denko Co., Ltd.) at 25°C to prepare a film adhesive. Cut the tape.

[0139] [Production of Mirror Silicon Wafer]

[0140] A silicon wafer (manufactured by Shin-Etsu Chemical Co., Ltd., thickness 0.6 mm) was ground to a thickness of 0.05 mm using a wafer back grinder (DFG-8560 manufactured by DISCO Co., Ltd.) to produce a mirror-surfaced silicon wafer.

[0141] [evaluate]

[0142] The following evaluations were perf...

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Abstract

The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25°C after the film adhesive is pasted to a mirror silicon wafer at 40°C of 0.5 N / 10 mm or more.

Description

technical field [0001] The present invention relates to a film adhesive, a dicing tape with a film adhesive, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] In the manufacture of semiconductor devices, methods for bonding semiconductor elements to metal lead frames (so-called die-bonding methods) have evolved from conventional gold-silicon eutectic methods to methods using solder and resin paste. A method using a conductive resin paste is currently being utilized. [0003] However, the method using the resin paste has problems in that the conductivity is lowered due to voids, or the thickness of the resin paste is not uniform, and the pad is contaminated due to extrusion of the resin paste. To solve these problems, film adhesives are sometimes used instead of resin pastes. [0004] For example, Patent Document 1 proposes an adhesive film capable of performing heat treatment at low temperature for die bonding by b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/02C09J133/00C09J163/00C09J11/04H01L21/52C09J7/20
CPCC09J11/04C08K3/0075H01L21/50H01L2221/68386H01L2221/68377H01L2221/68327H01L2221/68381C09J2205/102C08K3/08H01L24/83H01L21/6836C09J2203/326C09J7/02C09J2201/36C09J9/02H01L23/48C09J2201/622H01L2224/271H01L2224/29455H01L2224/29447H01L24/27H01L24/29H01L24/32H01L24/45H01L24/48H01L24/85H01L24/92H01L24/94H01L2224/27436H01L2224/2929H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29388H01L2224/29393H01L2224/29499H01L2224/32145H01L2224/32225H01L2224/32245H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48145H01L2224/48225H01L2224/48245H01L2224/83191H01L2224/83203H01L2224/83851H01L2224/83885H01L2224/83907H01L2224/85207H01L2224/92H01L2224/94H01L2224/27003H01L2224/29444H01L2224/29424H01L2224/48227H01L2224/48247H01L2924/01322H01L2924/181H01L2224/73265H01L2924/3511C08G59/621C09J163/00C09J7/20C08K3/02C08L33/06Y10T428/1405Y10T428/28C09J2301/208C09J2301/312C09J2301/408H01L2924/00014H01L2924/01006H01L2924/0635H01L2924/0665H01L2924/00012H01L2224/27H01L21/78H01L2224/83H01L2924/00C09J7/00H01L21/48
Inventor 菅生悠树木村雄大
Owner NITTO DENKO CORP
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