Low-modulus conductive adhesive for semiconductor chip packaging

A chip packaging, low modulus technology, applied in the field of conductive adhesive, can solve problems such as large modulus, and achieve the effect of small modulus and good electrical conductivity

Inactive Publication Date: 2014-09-03
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a conductive adhesive for semiconductor chip packaging to solve the technical problem of large modulus in the prior art

Method used

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  • Low-modulus conductive adhesive for semiconductor chip packaging
  • Low-modulus conductive adhesive for semiconductor chip packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] At room temperature, according to the components specified in Example 1 in the following table, diethylene glycol divinyl ether, triethylene glycol diacrylate, flexible polyester methacrylate oligomer and flexible Mix the epoxy acrylate oligomer at room temperature for 30 minutes until uniform, then add diacyl peroxide, peroxide ester, γ-glycidyl etheroxypropyl trimethoxysilane, γ-methacryloxypropyl trimethyl Oxysilane and γ-methacryloxypropyltriisopropoxysilane, mixed at room temperature for 30 minutes to form a homogeneous mixture, added submicron silver powder, applied vacuum at room temperature and mixed at low speed for 30 minutes to prepare a conductive adhesive .

Embodiment 2

[0030] At room temperature, according to the components specified in Example 2 in the table below, 1,4-cyclohexyldimethanol divinyl ether, tripropylene glycol diacrylate and flexible polyurethane methacrylate oligomer were prepared at room temperature Mix for 30 minutes until uniform, then add diacyl peroxide, γ-glycidyloxypropyltrimethoxysilane and γ-methacryloxypropyltrimethoxysilane, and mix for 30 minutes at room temperature to form a homogeneous mixture , add sub-micron silver powder, apply vacuum and mix at low speed for 60 minutes at room temperature to prepare conductive adhesive.

Embodiment 3

[0032] At room temperature, according to the components specified in Example 3 in the table below, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-cyclohexyldimethanol divinyl ether, Diethylene glycol diacrylate, flexible epoxy acrylate oligomer and flexible polyurethane methacrylate oligomer were mixed at room temperature for 30 minutes until uniform, then added peroxide, γ-glycidyl ether oxypropyl trimethoxy Base silane and γ-methacryloxypropyl triisopropoxysilane, mix at room temperature for 30 minutes to form a homogeneous mixture, add submicron silver powder, apply vacuum at room temperature and mix at low speed for 60 minutes to prepare the conductive adhesive.

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Abstract

The invention relates to a low-modulus conductive adhesive for semiconductor chip packaging, which is composed of the following components in parts by weight: 70-85% of submicro silver powder (A), 2-4% of vinyl ether monomer (B), 4-13% of acrylate monomer (C), 8-13% of acrylate oligomer (D), 0.1-1.0% of initiator (E) and 0.5-3% of coupling agent (F). By using the optimal combination of the vinyl ether monomer, acrylate monomer, acrylate oligomer and initiator, the cured adhesive layer has favorable conductivity and low modulus, and can effectively absorb stress generated by deformation on the interface between the chip and substrate.

Description

technical field [0001] The invention relates to a conductive adhesive for semiconductor packaging, in particular to a low-modulus conductive adhesive for larger-sized semiconductor chip packaging. Background technique [0002] In recent years, as the market demand for portable mobile devices represented by smartphones continues to rise, the application of larger-sized semiconductor chips that perform core functions has become more and more common, and its performance has become more and more critical. Semiconductor chips with basic functions must undergo packaging processes such as die bonding, wire bonding, and hermetic encapsulation before they can become practical electronic components to exert their designed performance. Therefore, in the packaging process process The various materials used in are very important. [0003] Die bonding is one of the key steps in the semiconductor chip packaging process. Conductive adhesive is widely used to bond the semiconductor chip and...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J4/02H01L33/56
Inventor 吴光勇王建斌陈田安解海华牛青山
Owner YANTAI DARBOND TECH
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