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Copper composite conductive powder with grapheme structure and wrapped by carbon layer and preparation method thereof

A technology of composite conductive powder and graphene, which is applied in the direction of metal/alloy conductors, cable/conductor manufacturing, circuits, etc., can solve the problems of high resistivity, copper powder is easy to be oxidized, etc., to prevent oxidation, prevent particle agglomeration, and resist Effect of Oxidation Performance Improvement

Active Publication Date: 2014-09-10
SHENZHEN EIGEN EQUATION GRAPHENE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a carbon layer-coated copper composite conductive powder with a graphene structure and a preparation method thereof, aiming at solving the problem that the copper powder of the conductive adhesive conductive filler in the prior art is extremely easy to The problem of being oxidized makes it cause the problem of high resistivity

Method used

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  • Copper composite conductive powder with grapheme structure and wrapped by carbon layer and preparation method thereof
  • Copper composite conductive powder with grapheme structure and wrapped by carbon layer and preparation method thereof
  • Copper composite conductive powder with grapheme structure and wrapped by carbon layer and preparation method thereof

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Effect test

Embodiment 1

[0060] 8.0g LPAN solution (molecular weight 4000, mass percentage 80%) was stirred at 120°C for 60 hours to form a microcyclized LPAN solution, and the microcyclized LPAN solution was heat-treated at 220°C for 8 hours to form a Thermally oxidized polyacrylonitrile oligomer (OPAN) solid, then add 7.5g of copper oxide powder, 30ml of solvent (water), and use a planetary ball mill to mill the sample, the ball-to-material ratio is 15:1, the speed is 400rad / min, and the ball mill is 10 h, after discharging, dry in an oven at 220°C for 3 hours to obtain a thermally oxidized precursor (that is, a low-temperature carbonized precursor-coated copper compound). Put the thermal oxidation precursor in a porcelain boat, under the protection of an inert atmosphere, the gas flow rate is 250ml / min, the selected temperature is 1000°C for calcination, the holding time is 6 h, and then cooled to room temperature to obtain a carbon layer coating with a graphene structure Copper composite conductiv...

Embodiment ２

[0062] 10.0g LPAN solution (molecular weight 2500, mass percentage 50%) was stirred at 80°C for 72 hours to form a microcyclized LPAN solution, and the microcyclized LPAN solution was heat-treated at 200°C for 10 hours to form a Thermally oxidized polyacrylonitrile oligomer (OPAN) solid, then add 4.0g of copper oxide powder, 15ml of solvent (methanol), and use a planetary ball mill to mill the sample with a ball-to-material ratio of 15:1, a speed of 400rad / min, and ball mill for 10 h, after discharging, dry in an oven at 180°C for 10 hours to obtain a thermally oxidized precursor (that is, a low-temperature carbonized precursor-coated copper compound). Put the thermal oxidation precursor in a porcelain boat, under the protection of an inert atmosphere, the gas flow rate is 10ml / min, the selected temperature is 1800°C for calcination, the holding time is 15h, and then cooled to room temperature to obtain a graphene-structured carbon layer-coated Copper composite conductive powd...

Embodiment 3

[0064] 10.0g LPAN solution (molecular weight 150, mass percentage 20%) was stirred at 300°C for 8 hours to form a microcyclized LPAN solution, and the microcyclized LPAN solution was heat-treated at 300°C for 1 hour to form a Thermally oxidized polyacrylonitrile oligomer (OPAN) solid, then add 4.0g of copper oxide powder, 20ml of solvent (ethanol), and use a planetary ball mill to grind the sample, the ball-to-material ratio is 15:1, the speed is 400rad / min, and the ball mill is 10 h, after discharging, dry in an oven at 250°C for 1 hour to obtain a thermally oxidized precursor (that is, a low-temperature carbonized precursor-coated copper compound). Put the thermal oxidation precursor in a porcelain boat, under the protection of an inert atmosphere, the gas flow rate is 500ml / min, the selected temperature is 1300°C for calcination, the holding time is 24 h, and then cooled to room temperature to obtain a carbon layer coating with a graphene structure Copper composite conducti...

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Abstract

The invention discloses copper composite conductive powder with a grapheme structure and wrapped by a carbon layer and a preparation method thereof. The preparation method comprises the steps of (A) stirring an LPAN solution at the temperature of 80-300 DEG C for 8-72 hours to form a micro-cyclized LPAN solution; (B) performing heat treatment on the micro-cyclized LPAN solution at the temperature of 200-300 DEG C for 1-10 hours to form a thermally oxidized polyacrylonitrile oligomer with a trapezoid structure; (C) adding the thermally oxidized polyacrylonitrile oligomer and a copper compound into a solvent and performing even mixing to obtain an LPAN wrapped copper compound; (D) drying the evenly-dried LPAN wrapped copper compound at the temperature of 180-250 DEG C for 1-10 hours till the solvent is completely evaporated to obtain a low-temperature carbonization precursor wrapped copper compound; (E) calcining the low-temperature carbonization precursor wrapped copper compound under the inert atmosphere protection and conditions of 10-500ml / mi gas flow and 300-1800 DEG C temperature for 6-24 hours, and accordingly obtaining the copper composite conductive powder with the grapheme structure and wrapped by the carbon layer.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a graphene-structured carbon layer-coated copper composite conductive powder and a preparation method thereof. Background technique [0002] With the rapid development and wide application of electronic technology, the industry's requirements for circuit integration are also increasing, and the demand for miniaturization and precision also makes electronic components have higher requirements for size and lead spacing. Conductive adhesive is an adhesive with certain conductivity after curing or drying. It is environmentally friendly, can provide fine-pitch printing, low-temperature curing, and simplifies the packaging process. It is widely used in microelectronic packaging and has gradually An alternative to traditional tin-lead solder. However, defects such as limited impact resistance, easy increase in electrical resistance in variable climate environments, and reduced mechan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B1/02
Inventor 刘剑洪张黔玲何传新徐坚任响宁李晓明廖楚宏
Owner SHENZHEN EIGEN EQUATION GRAPHENE TECH CO LTD
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