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A kind of halogen-free thermosetting resin composition, prepreg and laminated board

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, compounds of Group 5/15 elements of the periodic table, layered products, etc., which can solve the problems of high water absorption, low dielectric constant, resistance Low fuel efficiency and other issues, to achieve the effect of excellent dielectric constant

Active Publication Date: 2016-08-31
常熟生益科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reactive type is mainly DOPO compounds, mainly phosphorus-containing epoxy resin and phosphorus-containing phenolic resin, and the phosphorus content is between 2-10%. However, it is found in practical applications that phosphorus-containing epoxy resin is used as the main resin or Phosphorus-containing phenolic resin is a resin composition of epoxy resin curing agent, which has a large water absorption rate and a high dielectric constant, and the heat and humidity resistance of the board made of it is reduced; the additive type is mainly phosphazene And phosphate compounds, the flame retardant efficiency of additive flame retardants is lower than that of reactive types, and more phosphorus content needs to be added to achieve UL 94V-0 flame retardancy. At the same time, because of its low melting point (generally lower than 150°C), during the processing of laminates, it is easy to "migrate" to the surface of the board
[0004] Therefore, the application of the above-mentioned phosphorus-containing flame retardant technology often cannot meet the requirements of the formulation design of the resin composition with low dielectric constant and excellent moisture and heat resistance. Copper clad laminates with high heat resistance and low dielectric constant have become one of the future development directions of copper clad laminates

Method used

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  • A kind of halogen-free thermosetting resin composition, prepreg and laminated board
  • A kind of halogen-free thermosetting resin composition, prepreg and laminated board
  • A kind of halogen-free thermosetting resin composition, prepreg and laminated board

Examples

Experimental program
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Effect test

Synthetic example 1

[0041] Preparation 1 of phosphorus-containing active ester compound:

[0042] Weigh 0.6mol of 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10-oxide and 0.6mol of p-hydroxybenzaldehyde, add 65% mass Concentration of H 2 SO 4 , condensed and refluxed at 100°C for 3 to 5 hours, and then the mixture was washed with alcohol 4 to 6 times to obtain the pre-product; the above-mentioned pre-product was dissolved in toluene solution, and 0.2mol of benzoic acid was added. temperature conditions, add 0.05mol catalyst (AlCl 3 ), condensed and refluxed for 4 hours, and then after several times of washing, dried for 4 hours under vacuum at 105°C to obtain the desired phosphorus-containing active ester compound with an esterification rate of 70-80% and a phosphorus content of 6.4%. Phosphorus-containing active ester compound, denoted as C1, the specific structure is as follows:

[0043]

[0044] X= , Y=H, Z= , R is phenyl, R1=CH 3 , n is 3~5.

[0045] The NMR ...

Embodiment

[0051] According to the weight ratio shown in Table 1, epoxy resin, modified polyphenylene ether resin, phosphorus-containing active ester compound, curing accelerator, inorganic filler and solvent are added to the mixing tank, and the solid content of the glue is controlled to be 65%. Stir uniform, and matured for 8 hours to make a resin composition glue; then impregnate the glass cloth in the above resin composition glue; then bake the impregnated glass cloth at 155~175°C for 4~7min to form a prepreg ;Cut the prepreg to a certain size and stack 8 pieces of prepreg to form a stack. Place an electrolytic copper foil on the top and bottom of the stack, and send it to a vacuum press for pressing. The program is 150°C / 60min+200 °C / 120min to prepare a laminate.

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Abstract

The invention discloses a halogen-free thermosetting resin composition, a prepreg and a laminate. The halogen-free thermosetting resin composition comprises, by solid weight: (a) epoxy resin: 30-50 parts; (b) modified polymer Phenyl ether resin: 5~40 parts; (c) phosphorus-containing active ester: 15~50 parts; (d) reinforcing agent: 0~20 parts. The present invention designs a kind of halogen-free flame retardant low dielectric constant resin composition with phosphorus-containing active ester as flame retardant. Or after the introduction of phosphate ester as a flame retardant, the water absorption rate of the resin increases; at the same time, the introduction of an appropriate amount of modified polyphenylene ether resin can obtain a better dielectric constant, which is more conducive to its application in high-performance printing such as halogen-free high-speed circuit board field.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free resin composition, a prepreg and a laminate made by using the composition, and can be applied to the fields of high-density interconnection integrated circuit packaging and the like. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, the laminate material needs to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. However, ordinary epoxy resin ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/12C08K5/5313C07F9/6574C08J5/24B32B27/04B32B27/18B32B15/092
Inventor 戴善凯崔春梅肖升高季立富黄荣辉谌香秀
Owner 常熟生益科技有限公司