Cleaning Fluid Additive for Polysilicon Chain Texturing Equipment and Its Application

Abstract

The invention provides a cleaning liquid additive for polycrystalline silicon chain-type texturing equipment. The cleaning liquid additive comprises the following components: a fluorocarbon surfactant, sodium dodecyl benzene sulfonate, hydroxyethyl cellulose and the balance of water. The invention also provides a cleaning liquid of the polycrystalline silicon chain-type texturing equipment. The cleaning liquid contains an alkali liquid and the cleaning liquid additive, wherein a mass ratio of the cleaning liquid additive to the alkali liquid is (0.5-5):100; and the alkali liquid is an aqueous liquid of inorganic base. The cleaning liquid is high in safety and stability and is high in cleaning capacity of the texturing equipment, and the environment is not polluted.

Description

Technical field [0001] The invention relates to a cleaning liquid additive for polysilicon chain type texturing equipment and its application. Background technique [0002] At present, in the production process of polysilicon solar cells, the silicon wafers will introduce impurities in the cutting process, texturing, cleaning, etc. The cleaning process will cause the silicon wafer cleaning tank, positioning rollers, transmission rollers and other devices to be dirty. Impurities are likely to remain on the surface of the silicon wafer, forming pollution that is difficult to remove; the solar cell produced in this way has obvious traces of pollution on the surface, and the photoelectric conversion efficiency is low. [0003] At present, the commonly used cleaning agent for polysilicon chain type texturing equipment is 50-70 wt% high concentration hydrofluoric acid. The amount of hydrofluoric acid is large, it takes a long time, the cleaning effect is not ideal, and it also causes ser...

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Problems solved by technology

[0002] At present, in the production process of polycrystalline silicon solar cells, impurities will be introduced into silicon wafers during the cutting process, texturing, and cleaning processes. During the texturing and cleaning process, dirt will be generated on the silicon wafer cleaning tank, positioning rollers, and transmission rollers. It is easy to leave impurities on the surface of the silicon wafer, forming pollution that is difficult to remove; the solar cells produced in this way have obvious traces of pollution on the surface, and the photoelectric conversion efficiency is low

[0003] At present, the commonly used cleaning agent for polysilicon chain texturing equipment is 50-70 wt % high-concentration hydrofluoric acid, which consumes a large amount of hydrofluoric acid and takes a long time. The cleaning effect is not very satisfactory, and it also causes serious pollution to the environment.

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