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A kind of preparation method of PTFE composite dielectric substrate for microwave circuit

A composite dielectric and microwave circuit technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the impact of dielectric properties and water absorption of PTFE composite dielectric substrates, organic additive residues, and complex process flow and other problems, to achieve the effects of good dispersion of fillers, lower water absorption and porosity, and simple process

Active Publication Date: 2016-05-25
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method can reduce the voids and water absorption of the substrate, it also has the disadvantages of complicated process and high manufacturing cost.
[0007] In the existing preparation methods of PTFE composite dielectric substrates without reinforcement materials, there are complicated process flow, and various organic additives need to be added to improve the dispersion effect of PTFE and fillers
In the process of removing organic additives, it generally takes a long time (more than 4h) high temperature (above 200°C) treatment to remove organic additives, and there may still be residues of organic additives, which will affect the dielectric properties of PTFE composite dielectric substrates. Affects performance and water absorption

Method used

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  • A kind of preparation method of PTFE composite dielectric substrate for microwave circuit

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Experimental program
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Effect test

Embodiment 1

[0041] Suspended PTFE resin powder, particle size 35 μm, produced by Daikin Corporation of Japan.

[0042] Inorganic filler: microsilica powder, particle size about 1.5 μm, Donghai Microsilica Powder Factory.

[0043] The diameter of the large particle size zirconia beads is 2.0 mm, and the diameter of the small particle size zirconia beads is 0.5 mm.

[0044] Deionized water: self-made in the laboratory.

[0045] Take 500g of the above-mentioned suspended PTFE resin powder, add 300g of silicon micropowder, 200g of zirconia beads (large particle size beads: small particle size beads=3:1), and 500g of deionized water in a planetary ball mill at a revolution frequency of 50Hz (rotating speed of 3000r / min) at a high-speed ball mill for 1 hour, filtered, and the zirconia beads were separated to obtain a uniformly mixed dispersion.

[0046] Put the above dispersion in an oven at 100°C, bake for 2 hours, remove water, and obtain agglomerated solids; put the agglomerated solids and z...

Embodiment 2

[0049] Suspended PTFE resin powder, particle size 80 μm, produced by Daikin Corporation of Japan.

[0050] Inorganic filler: silica powder, particle size about 1.5 μm, Donghai Silicon Powder Factory; titanium dioxide, particle size about 0.25 μm, American Huntsman Corporation.

[0051] The diameter of the large particle size zirconia beads is 2.0 mm, and the diameter of the small particle size zirconia beads is 0.5 mm.

[0052] Deionized water: self-made in the laboratory.

[0053] Get above-mentioned suspension PTFE resin powder 350g, add 150g microsilica powder, 550g titanium dioxide, 300g of zirconia beads (large particle size beads: small particle size beads=3:1), 600g of deionized water, in planetary ball mill with revolution frequency 60Hz (ball milling speed: 3600r / min) high-speed ball milling for 1h, and filtering to separate the zirconia beads to obtain a uniformly mixed dispersion.

[0054] Put the above dispersion in an oven at 100°C, bake for 2 hours, remove wate...

Embodiment 3

[0057] Tetrafluoroethylene-perfluoroalkoxy vinyl ether resin powder, particle size 50 μm, produced by Daikin Corporation of Japan.

[0058] Inorganic filler: silica powder, particle size about 1.5 μm, Donghai Silicon Powder Factory; titanium dioxide, particle size about 0.25 μm, American Huntsman Corporation.

[0059] The diameter of the large particle size zirconia beads is 2.0 mm, and the diameter of the small particle size zirconia beads is 0.5 mm.

[0060] Deionized water: self-made in the laboratory.

[0061] Get above-mentioned suspension PTFE resin powder 350g, add 150g microsilica powder, 550g titanium dioxide, 300g of zirconia beads (large particle size beads: small particle size beads=3:1), 600g of deionized water, in planetary ball mill with revolution frequency 40Hz (rotating speed: 2400r / min) high-speed ball mill for 1 hour, and filter to separate the zirconia beads to obtain a uniformly mixed dispersion.

[0062] Put the above dispersion in an oven at 100°C, ba...

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Abstract

The invention relates to a preparation method of a PTFE (polytetrafluoroethylene) composite medium substrate for a microwave circuit, and the method comprises the following steps: first, fluorine resin powder, inorganic filler and zirconia beads according to a certain proportion are added, and deionized water as a lubricant is added for high speed ball milling to obtain uniformly dispersed emulsion; the emulsion is dried for moisture removal for low speed ball milling to obtain uniformly dispersed powder; then the uniformly dispersed powder is evenly filled into a mold, and molded into a sheet with a certain thickness, both sides of the sheet are coated with copper foil for high temperature laminating sintering to obtain the PTFE (polytetrafluoroethylene) composite medium substrate for the microwave circuit. According to the method, by the way of first wet ball milling and then dry ball milling, the filler and PTFE system can be effectively mixed, the technical process and energy consumption can be reduced, and the use of organic additives can be avoided so as to ensure the excellent performances of PTFE play.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a method for preparing high-frequency copper-clad laminates with PTFE dielectric substrates, and in particular to a method for preparing PTFE composite dielectric substrates for microwave circuits. Background technique [0002] With the gradual development of electronic information products towards high frequency and high speed, the traditional FR-4 substrate materials will be gradually replaced by high speed, high frequency and high reliability substrate materials. In recent years, scientific and technological workers have conducted in-depth research on the selection and performance of high-frequency and high-speed substrate materials, aiming to find substrate materials with excellent dielectric, mechanical and thermal properties to meet the requirements of actual use. [0003] Since the commercial production of polytetrafluoroethylene (PTFE) by DuPont in 1945, due...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/15B32B37/06B32B37/10B32B38/16
Inventor 邓华阳江恩伟黄增彪
Owner GUANGDONG SHENGYI SCI TECH