A new type of power electronic module

Abstract

The purpose of the present invention is to provide a new type of power electronic module for the shortcomings of the existing DBC board in current sharing design. The power device chip and the busbar terminal are characterized in that the module further includes 3 or more power device chips connected in parallel, and the busbar terminal is placed at the center of all the above parallel connected chips. The distributed inductance of each branch circuit is consistent, which greatly realizes the parallel consistency of the topology and improves the reliability of the module. Eliminates the uneven inductance of the branch circuit of the parallel circuit, and realizes the uniformity of the branch circuit, which is beneficial to the parallel current sharing under high frequency and high power, greatly relieves the heat dissipation pressure, and improves the reliability of the module sex.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to high-power power semiconductor modules, power control circuits, intelligent power components and high-frequency switching power supplies, and in particular to a DBC board design structure for power electronics power modules. Background technique [0002] DBC is a power module with a ceramic-metal composite board structure. Generally, silica gel is poured into the upper surface of the heat source of the power module, and the lower surface of the heat source is connected to the radiator through a double-sided copper-clad board (DBC) and the substrate. This heat dissipation structure can make The heat generated when the power module is working is effectively dissipated downward, thereby avoiding excessive junction temperature and preventing the power module from being damaged by high temperature. The substrate is generally made of metal (such as copper or aluminum) or comp...

AI Technical Summary

Problems solved by technology

With the high-frequency development of power electronic devices and the introduction of new SiC devices into production applications, the proportion of inductive reactance components in DBC boards is increasing. At the same time, considering that high-power modules are one of the mainstream trends in the future, it is inevitable to For the parallel connection of devices on the same module, the traditional DBC circuit design has the inhomogeneity of the parallel circuit, which leads to the dynamic and static non-uniformity of the parallel devices, which leads to the power concentration on a chip of a single parallel circuit, resulting in excessive heat generation and even failure. This situation is especially serious at high frequency and high power, so the parallel current sharing of DBC boards will be a big problem in the future

Images