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Device and method for manufacturing laser micro-pit array

A technology for manufacturing devices and micro-pits, applied in manufacturing tools, laser welding equipment, welding equipment, etc., can solve problems such as low efficiency, and achieve the effects of ensuring repeatability, improving processing efficiency, and improving surface quality

Active Publication Date: 2016-04-27
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, the current micro-pit processing technology generally uses point-by-point laser processing to process the surface of the workpiece, and the efficiency is low.

Method used

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  • Device and method for manufacturing laser micro-pit array
  • Device and method for manufacturing laser micro-pit array
  • Device and method for manufacturing laser micro-pit array

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Embodiment Construction

[0026] The technical solutions of the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] The inventive device such as figure 1 and figure 2 As shown, it includes a pulsed laser 1, a homogenizer 3, a total reflection mirror 4, a converging lens 5, a water spray device 6, an absorbing layer 8, a flat screen 9, a flexible film 10, a fixture 12, a workbench 13, a signal line 14 and Controller 15; the light outlet of the pulse laser 1 is provided with a total reflection mirror 4, the total reflection mirror 4 is 45° to the horizontal direction, the homogenizer 3 is fixed between the pulse laser 1 and the total reflection mirror 4, and the total reflection mirror 4 A converging lens 5 is arranged below, and the lower part of the converging lens 5 faces the workbench 13, which is a two-axis linkage workbench in the X and Y directions. Place the flexible film 10 and the flat net 9 sprayed wit...

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Abstract

The invention discloses a laser micro-pit array manufacturing device and method, and relates to the field of laser micro-pit manufacturing. In the present invention, firstly, the upper surface of the workpiece is sequentially covered with a flexible film and a flat net sprayed with an absorbing layer, and they are clamped together on a workbench, and a water spray device sprays a water layer on the surface of the flat net. The laser beam penetrates the water layer, and part of the laser beam passes through the mesh of the flat screen to ablate the flexible film and the surface of the workpiece, forming micro pits and a large amount of splashed slag; the other part of the laser beam is blocked and absorbed by the absorbing layer to generate plasma The explosion forms a shock wave, which makes the flat screen, the flexible film and the surface of the workpiece close together without leaving any gaps between them, preventing the slag from entering the surface of the workpiece in the non-laser irradiation area. The invention can improve the surface quality of the micro-pit, prevent the slag from adhering to the periphery of the micro-pit, improve the processing efficiency, ensure the repeatability of the size of the micro-pit, and can process micro-pit arrays of various shapes and distributions on the surface of the workpiece .

Description

technical field [0001] The invention relates to the field of laser micro-pit array manufacturing, in particular to a laser micro-pit array manufacturing technology capable of avoiding slag adhesion. Background technique [0002] The micro-pit array on the surface of the friction pair can improve the bearing capacity, reduce the friction coefficient, reduce friction loss, and also play a role in storing lubricating oil and collecting abrasive particles. Therefore, the processing of micro-pit has become a research topic in tribology. hotspot. [0003] Laser processing has become the most widely used micro-pit processing technology because of its advantages such as fast processing speed, no pollution to the environment, and easy control. Laser micro-pit processing is divided into laser-induced shock wave micro-pit processing and laser ablation micro-pit processing. Among them, the laser-induced shock wave micro-dimple processing is limited to the research stage because of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/362B23K26/146B23K26/18
CPCB23K26/083B23K26/18
Inventor 温德平戴峰泽张永康丁玎
Owner JIANGSU UNIV
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