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A kind of high-strength cu-ni-si alloy and preparation method thereof

A cu-ni-si, high-strength technology, applied in the field of copper alloy materials, can solve the problems of low alloy tensile strength and conductivity, low alloy strength and conductivity, and no strength data, etc., to slow down the recrystallization process, Resistant to grain segregation, strength and hardness improvement effects

Inactive Publication Date: 2016-11-02
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Chinese patent on April 24, 2012 (publication number CN 102676876A) discloses a high-strength and high-conductivity copper alloy material and its manufacturing method. In this invention, Cr, Al, and Be trace elements are added to the Cu-Ni-Si alloy, and deformation aging treatment is obtained. The tensile strength and electrical conductivity of the alloy are low
Chinese patent on June 5, 2012 (publication number CN 102703754A) discloses a Cu-Ni-Si-based alloy and its preparation method. In this invention, a trace element V is added to the Cu-Ni-Si alloy, and the conductivity of the alloy is relatively high. High, but its hardness is low, and no strength data
The patent applied on March 14, 2012 (publication number CN 103429771A) relates to a Cu-Ni-Si alloy strip with excellent bending workability, in which the contents of Ni and Si are 1.0-4.5% and 0.2-1.0%, respectively. The hot workability of the alloy limits the concentration of Si to no more than 1.0%, resulting in low strength and electrical conductivity of the alloy

Method used

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  • A kind of high-strength cu-ni-si alloy and preparation method thereof

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Embodiment 1

[0021] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.0% Ni, 0.52% Si, 0.53% Ti, 1.0% Mn, 1.0% Ag, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0022] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0023] (1) Melting and mold casting: put the metal raw materials of the above components into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, and then fill the furnace with argon until the pressure in the furnace is 0.05MPa. The melting sequence is: add electrolytic nickel, silicon and part of copper → bake the material at 100 ° C for 15 minutes → heat up to melt copper, nickel, silicon → 1000 ° C Refining at low temperature for 10 minutes→increase the power and add titanium, manganese, silver (titanium, manganese and silver are all added in the form ...

Embodiment 2

[0030] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.5% Ni, 0.6% Si, 1.0% Ti, 0.7% Ag, 0.9% Mn, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0031] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0032] (1) Melting and mold casting: put the metal raw materials of the above components into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill the furnace with argon until the pressure in the furnace is 0.05MPa, the melting sequence is: add electrolytic Ni, Si and part of Cu → bake the material at 100°C for 15min → heat up to melt copper, nickel, silicon → 1000°C Refining at low temperature for 10min→increase the power and add Ti, Mn, Ag and the remaining Cu in the form of Ti-Cu, Mn-Cu and Ag-Cu master alloy→transmit electricity and raise the t...

Embodiment 3

[0039] A high-strength Cu-Ni-Si alloy composed of the following components by weight percentage: 2.5% Ni, 0.6% Si, 1.0% Ti, 0.7% Ag, 0.9% Mn, and the balance is copper and Unavoidable impurity elements, and Ni is generated inside the alloy 2 Si non-oxide reinforcement phase.

[0040] The preparation method of above-mentioned high strength Cu-Ni-Si alloy is:

[0041] (1) Refer to Example 2 for the smelting and casting mold preparation process; wherein, the smelting temperature is controlled at 1280°C during smelting, and the casting temperature is controlled at 1180°C;

[0042] (2) Homogenization treatment: heat the cast ingot obtained in step (1) to 990°C and keep it warm for 4 hours for homogenization annealing treatment;

[0043] (3) Hot-rolling deformation treatment: heat the ingot obtained in step (2) to 950°C, keep it warm for 10 minutes, and perform hot-rolling deformation treatment, and the hot-rolling rate is controlled at 0.1s -1 , 60% hot-rolled deformation, to ob...

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Abstract

A high-strength Cu‑Ni‑Si alloy and a preparation method thereof, the alloy is composed of 2.0 to 6.0% Ni, 0.5 to 1.5% Si, 0.5 to 1.0% Ti, 0.5 to 1.0% Mn, 0.5 to 1.0% Ag, and the balance It is composed of copper and unavoidable impurity elements; its preparation process includes smelting, mold casting, homogenization treatment, hot rolling, solution treatment, pre-cold rolling, aging treatment and cold rolling deformation, and the alloy of the present invention generates Ni 2 Si non-oxide reinforcement phase, after repeated rolling, can increase the nucleation position of the precipitated phase, the more the grains are broken, the more grain boundaries are produced, the more nucleation sites of the precipitated phase are, so the precipitated phase will be more More and more times of aging, more precipitates will be precipitated, the overall performance of the alloy will be greatly improved, the strength, high temperature elongation and electrical conductivity of the alloy will be improved, and the bending performance of the alloy will be improved.

Description

technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a high-strength Cu-Ni-Si alloy and a preparation method thereof. Background technique [0002] Cu-Ni-Si alloys are a class of alloys with high electrical conductivity that are widely used. At present, they are widely used in lead frames for large-scale integrated circuits, contact wires for trams and electric locomotives, commutators for electric tools, and molds for continuous casting machines. Lining and other fields. With the continuous development of the IT industry around the world, integrated circuits composed of chips and lead frames occupy the core position in electronic information technology, thus putting forward higher requirements for the performance of lead frame copper alloys for large-scale integrated circuits. [0003] Chinese patent on April 24, 2012 (publication number CN 102676876A) discloses a high-strength and high-conductivity copper alloy ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22C1/03C22F1/08
Inventor 张毅李丽华周洪雷刘勇柴哲许倩倩孙慧丽龙永强
Owner HENAN UNIV OF SCI & TECH
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