A kind of pcb surface treatment method

A surface treatment and concentration technology, applied in the secondary treatment of printed circuits, the formation of electrical connection of printed components, electrical components, etc., can solve the problems of contaminated gold surface, long process flow, unclean development, etc. The effect of reducing process flow and maintaining solderability

Active Publication Date: 2017-11-28
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems that in the existing PCB production, the two surface treatments of electro-gold fingers and immersion nickel-gold need to be carried out completely independently, resulting in the pollution of the gold surface by the dry film, unclean development, and long process flow, etc., and provides a method that can improve PCB surface treatment method with PCB quality and short process flow

Method used

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  • A kind of pcb surface treatment method

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Effect test

Embodiment 1

[0018] A PCB surface treatment method provided in this embodiment includes two surface treatments of immersion nickel gold and electric gold finger, and the method specifically includes the following steps:

[0019] (1) According to the existing PCB production technology, the board is first cut, and then each PCB production unit (PNL) is sequentially subjected to wet film coating, exposure, development, etching and film removal, so as to make each inner layer board. The inner layer boards are pressed together to form a multi-layer board, and then the outer layer circuits are made on the multi-layer board to form a PCB semi-finished board. details as follows:

[0020] Cutting: Cut out the core board according to the board size 520mm*620mm, and the thickness of the core board is 0.5mm H / H.

[0021] Inner layer: Produced by a vertical coating machine, the film thickness is controlled to 8μm, and a fully automatic exposure machine is used to complete the inner layer circuit expos...

Embodiment 2

[0045] This embodiment provides a PCB surface treatment method, which includes two surface treatments of immersion nickel gold and electric gold finger. is 30°C.

[0046] The resulting PCB is labeled P2.

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Abstract

The invention relates to the technical field of circuit board production, in particular to a method for surface treatment of PCBs. Firstly, the nickel-gold treatment is carried out on the gold finger position and the welding position at the same time, and then the blue glue is pressed on the PCB, and then on the gold finger position. Electric thick gold treatment. The invention can reduce the process flow and save the process of pasting the dry film or coating the anti-static gold ink in the existing process, thereby avoiding the pollution of the gold surface by the dry film, unclean film removal, unclean development, and loss of anti-static gold ink The emergence of such phenomena and the problem of dumping money. By controlling the phosphorus content in the chemical water used in the nickel immersion gold treatment and controlling the electroplating solution in the electroplating gold treatment, the hardness of the gold finger can be guaranteed to be above 142 HVN, and it can be inserted more than 20,000 times without damage. By controlling the temperature of the blue glue, the blue glue can be closely attached to the immersion gold layer on the welding position, preventing the gold from being electro-plated on the immersion gold layer, and ensuring that the immersion gold layer is not polluted by the blue glue and maintaining good reliability. Solderability.

Description

technical field [0001] The invention relates to the technical field of PCB production, in particular to a PCB surface treatment method. Background technique [0002] PCB is the support of electronic components and the carrier of electrical connections. It is one of the important components of the electronics industry. It is used in almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapons. system etc. In the production of PCB, surface treatment is the last process in the PCB manufacturing process, which is used to protect the copper surface of PCB to ensure the excellent solderability of PCB. The existing surface treatment methods usually include hot air spraying tin, chemical nickel gold, chemical silver, chemical tin, etc., and gold-plated fingers on the gold fingers. In the existing PCB production technology, when a production unit (PNL) requires two different surface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/28H05K3/40
Inventor 黄力邓峻白会斌王海燕
Owner JIANGMEN SUNTAK CIRCUIT TECH
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