Ultrahigh thermal conductivity diamond/aluminum composite material and preparation method thereof

Abstract

The invention relates to a composite material and a preparation method of the composite material, in particular to an ultrahigh heat-conduction diamond / aluminum composite material and a preparation method of the ultrahigh heat-conduction diamond / aluminum composite material. In order to solve the technical problems that a diamond / aluminum composite material prepared with the existing method is low in heat conductivity and poor in interface combination strength, the ultrahigh heat-conduction diamond / aluminum composite material is composed of a reinforcement body and matrix alloy. The preparation method includes the steps that monocrystal diamond particles are contained in a cavity of a graphite die for preheating, and melted aluminum or aluminum alloy is poured to the interior of the graphite die; pressure impregnation is carried out, cooling is carried out, die releasing is carried out, and then the ultrahigh heat-conduction diamond / aluminum composite material is obtained. The diamond / aluminum composite material is good in interface combination and has the advantages of being light, high in thermal conductivity, devisable in coefficient of thermal expansion and the like. According to the ultrahigh heat-conduction diamond / aluminum composite material prepared with the method, the size fraction of the reinforcement body can range from 55% to 70%, the heat conductivity can reach 670 W / (m K), and the thermal diffusivity can reach 3.0 cm<2> / s. The ultrahigh heat-conduction diamond / aluminum composite material and the preparation method belong to the field of composite material preparation.

Description

technical field [0001] The invention relates to a composite material and a preparation method thereof. Background technique [0002] The development of semiconductor technology is changing with each passing day, and electronic equipment is developing towards the trend of miniaturization, light weight, high performance and multi-function. Due to the rapid increase of chip integration, the heat generated per unit area of ​​integrated circuits is increasing. In order to dissipate the heat quickly, higher requirements are put forward for the performance of packaging materials. Especially in some aerospace and military defense fields, some high-power components, such as laser diodes, high-power oscilloscopes and other high-heat packages, traditional Kovar alloy, tungsten-copper, molybdenum-copper composite materials, silicon carbide aluminum And silicon-aluminum composite materials have low thermal conductivity, and some materials also have the disadvantage of high density, whic...

AI Technical Summary

Problems solved by technology

[0015] The present invention aims to solve the technical problems of low thermal conductivity and poor interface bonding strength of the diamond / aluminum composite material prepared by the existing method, and provides an ultra-high thermal conductivity diamond / aluminum composite material and its preparation method

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