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Liner and substrate separation process and flexible display device and manufacturing process thereof

A flexible display and substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as difficult to control the balance of adhesion, difficult separation process, flexible film substrate detachment, etc., to achieve increased Adhesion, simple separation process, and the effect of increasing the contact area

Inactive Publication Date: 2015-02-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method in the prior art has some defects: flexible substrates and substrates need to withstand harsh experimental conditions such as ion bombardment, chemical corrosion, ultraviolet radiation, and high-temperature treatment during the subsequent preparation of electronic devices, resulting in the substrate The adhesion between the substrate and the substrate is greatly improved, and it is very easy to damage the flexible substrate film and the electronic devices on it when the flexible film substrate is detached from the hard substrate; on the contrary, if the flexible film substrate and the hard substrate If the adhesion is too weak, there will be a problem of accidental detachment of the flexible film substrate during the fabrication of the device.
Nevertheless, the balance of adhesion is still difficult to control, and it is even more difficult to find a separation process suitable for various experiments and production environments

Method used

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  • Liner and substrate separation process and flexible display device and manufacturing process thereof
  • Liner and substrate separation process and flexible display device and manufacturing process thereof
  • Liner and substrate separation process and flexible display device and manufacturing process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The substrate and substrate separation process for the preparation of a flexible display device in this embodiment includes the following steps:

[0033] (1) Prepare a flexible film substrate on the substrate, the flexible film substrate is located on the substrate, and covers the side of the substrate, that is, covers the upper surface and the side of the substrate, and is partially covered;

[0034] The substrate is a hard material with a thickness of 1-2000 microns, which can be made of glass, metal, plastic and fiber, or a substrate based on the above materials with a buffer layer.

[0035] The material of the flexible film substrate 200 can be polyimide (Polyimide, PI), polyethylene terephthalate (Polyethylene terephthalate, PET), polyethylene naphthalate (Polyethylene naphthalate, PEN), polyethylene Carbonate (Polycarbonate, PC), polyethersulfone (Polyethersulfone, PES), polyacrylate (Polyacrylate, PAR), polyetherimide (Polyetherimide), polyamide (Polyamide, PA) o...

Embodiment 2

[0045] A substrate and substrate separation process for the preparation of a flexible display device in this embodiment, other features are the same as in Embodiment 1, except for the following features:

[0046] In the step (1) of this embodiment, when the flexible film substrate is prepared on the substrate, the flexible film substrate is located on the substrate, and covers the side surface and the lower bottom surface of the substrate, that is, covers the upper and lower bottom surfaces and the side surfaces of the substrate, that is, completely covered; the prepared structure as image 3 shown.

[0047] This structure can maximize the adhesion of the flexible film substrate to the substrate without changing the physical and chemical properties of the flexible film substrate, and reduce the probability of detachment.

[0048] After the device is fabricated, it can be dissociated by cutting.

[0049] Step (3) of the present embodiment is specifically as follows: as Figu...

Embodiment 3

[0052] The substrate and substrate separation process for the preparation of a flexible display device in this embodiment includes the following steps:

[0053](1) Prepare a sacrificial layer on the substrate, and then prepare a flexible film substrate on the sacrificial layer; the flexible film substrate covers the upper surface and side of the sacrificial layer, and the side of the substrate is a partially covered structure;

[0054] The sacrificial layer can be more than one of carbon single material film and nitride material film, and can be a single-layer structure or a multi-layer structure;

[0055] The carbon material is amorphous carbon, carbon nanotubes, graphene, fullerene or diamond-like carbon;

[0056] The nitride material is silicon nitride, aluminum nitride, gallium nitride or indium nitride.

[0057] The sacrificial layer can be prepared by any one of chemical vapor deposition, physical vapor deposition or solution processing.

[0058] (2) Electronic compone...

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Abstract

The invention discloses a liner and a substrate separation process. The liner separation process includes the steps of 1), manufacturing the flexible membrane liner on a substrate, wherein the flexible membrane liner is located on the substrate and wraps the side face of the substrate; 2), manufacturing an electronic element on the flexible membrane liner; 3), vertically cutting from the surface of the flexible membrane liner along the outer periphery of the electronic element and dissolving the flexible membrane liner to obtain a finished flexible display device. The invention further discloses a flexible display device manufacturing process including the liner and the substrate separation process and the flexible display device manufactured by the manufacturing process. The flexible liner can be stably attached to the rigid substrate during subsequent device manufacturing processes, and separation of the liner and the substrate is simple, low in cost, rapid and free of damage to performance of the device.

Description

technical field [0001] The invention relates to a preparation technology of a flexible display device, in particular to a separation process of a substrate and a substrate, a flexible display device and a preparation process thereof. Background technique [0002] In the preparation of flexible display devices, a flexible thin film substrate is first formed on a hard substrate, and then electronic devices are fabricated on the flexible thin film substrate, and finally the flexible thin film substrate is separated from the substrate to obtain a finished device without the substrate. However, this method in the prior art has some defects: flexible substrates and substrates need to withstand harsh experimental conditions such as ion bombardment, chemical corrosion, ultraviolet radiation, and high-temperature treatment during the subsequent preparation of electronic devices, resulting in the substrate The adhesion between the substrate and the substrate is greatly improved, and i...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/46H01L21/77
CPCH01L21/00H01L21/46H01L21/77
Inventor 王磊许志平邹建华徐苗陶洪彭俊彪
Owner SOUTH CHINA UNIV OF TECH