Copper electroplate liquid and preparation method thereof

A technology of copper electroplating solution and solution, applied in the field of copper electroplating solution and preparation, can solve the problems of easy scorching, toxicity of electroplating solution, poor ductility of coating layer, etc.

Inactive Publication Date: 2015-03-04
WUXI NUIST WEATHER SENSOR NETWORK TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plating layer formed by this electroplating solution has poor ductility, poor current ef

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The formula of this electroplating solution is as follows: copper sulfate 80g / L, cupric chloride 50g / L, sodium sulfate 40g / L, potassium sulfate 60g / L, brightener 5g / L, wetting agent 5g / L, buffering agent 25g / L, Add deionized water to 1000ml.

[0029] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.

Embodiment 2

[0031] The formula of this electroplating solution is as follows: copper sulfate 97g / L, copper chloride 60g / L, sodium sulfate 47g / L, potassium sulfate 75g / L, brightener 11 g / L, wetting agent 8.5g / L, buffering agent 32g / L L, add deionized water to 1000ml.

[0032] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.

Embodiment 3

[0034] The formula of this electroplating solution is as follows: copper sulfate 114g / L, copper chloride 70g / L, sodium sulfate 54g / L, potassium sulfate 90g / L, brightener 17 g / L, wetting agent 12g / L, buffering agent 39 g / L L, add deionized water to 1000ml.

[0035] The preparation method of the copper electroplating solution is to weigh an appropriate amount of wetting agent according to the formula, add deionized water, and stir until dissolved; then weigh an appropriate amount of silver nitrate, potassium sulfate, and sodium sulfate and add them to the above solution, and stir at room temperature until dissolved; then heat the above solution to 65°C with a water bath, add an appropriate amount of brightening additives, adjust the pH value of the solution with a buffer, and stir evenly.

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PUM

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Abstract

The invention relates to a copper electroplate liquid and a preparation method thereof. The formula of the electroplate liquid comprises the following raw materials: 80-150g/L of copper sulfate, 50-90g/L of copper chloride, 40-70g/L of sodium sulfate, 60-120g/L of potassium sulphate, 5-30g/L of a brightener, 5-20g/L of a wetting agent, 25-55g/L of a buffer agent and deionized water added to 1,000ml. The method comprises the following steps: putting the deionized water into a container; weighing a proper amount of brightener and a proper amount of wetting agent, stirring and dissolving; weighing a proper amount of copper sulfate and a proper amount of sulfur copper chloride to a solution, stirring and dissolving at room temperature; adding sodium sulfate and potassium sulphate to the solution; and heating the solution to 55-65 DEG C, heating and stirring, and then adjusting the pH value of the solution by adopting the buffer agent. A clad layer formed by the method is good in ductility, free of brittleness, bright in surface, high in flatness, strong in throwing power and covering power, and high in current efficiency; the electroplate liquid is non-toxic; and a high-density zone of the clad layer is not scorched.

Description

technical field [0001] The invention relates to a copper electroplating solution and a preparation method, belonging to the technical field of electroplating solutions. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. The outer layer of many coins is also electroplated. [0003] During electroplating, the plated metal or other insoluble materials are used as the anode, and the workpiece to be plated is used as the cathode, and the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a coating. In order t...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 禹胜林
Owner WUXI NUIST WEATHER SENSOR NETWORK TECH
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