Electric-conduction high-temperature-resistant anticorrosion chip
A technology of high temperature resistance and chips, which is applied in the direction of anti-corrosion coatings, conductive coatings, circuits, etc., can solve the problems of inability to increase the power of sensors, chip conduction can not take into account anti-corrosion and high temperature resistance, and the conductive effect is not obvious, so as to achieve good conductive effect and excellent anti-corrosion The effect of high temperature resistance and simple preparation process
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Embodiment 1
[0025] A conductive high-temperature-resistant anti-corrosion chip, the three-layer conductive high-temperature-resistant anti-corrosion coating arranged on the chip all includes the following components in parts by mass: 45 parts of acrylic resin, 20 parts of molecular sieves, 5 parts of asbestos fiber, two 5 parts of manganese oxide, 2 parts of copper hydroxide, 5 parts of silicon micropowder, 1 part of nano aluminum oxide, 1.5 parts of benzimidazole, 0.5 parts of sodium polyacrylate, 25 parts of toluene, 20 parts of ethyl acetate;
[0026] The preparation method of above-mentioned conductive anticorrosion chip coating comprises the steps:
[0027] Step (1): Grinding copper hydroxide and molecular sieves into a fine powder with a particle size of 100-150 mesh;
[0028] Step (2): Add manganese dioxide, silicon micropowder, magnesium sulfate, nano-alumina, and benzimidazole into the mixer, then add copper hydroxide and molecular sieves ground in step (1), and stir until they a...
Embodiment 2
[0031] A conductive high-temperature-resistant anti-corrosion chip, the three-layer conductive high-temperature-resistant anti-corrosion coating arranged on the chip all includes the following components in parts by mass: 48 parts of acrylic resin, 22 parts of molecular sieves, 6 parts of asbestos fiber, two 5 parts of manganese oxide, 2 parts of copper hydroxide, 5 parts of silicon micropowder, 1.5 parts of nano-alumina, 1.8 parts of benzimidazole, 1 part of sodium polyacrylate, 28 parts of toluene, 22 parts of ethyl acetate;
[0032] The preparation method of above-mentioned conductive anticorrosion chip coating comprises the steps:
[0033] Step (1): Grinding copper hydroxide and molecular sieves into a fine powder with a particle size of 100-150 mesh;
[0034] Step (2): Add manganese dioxide, silicon micropowder, magnesium sulfate, nano-alumina, and benzimidazole into the mixer, then add copper hydroxide and molecular sieves ground in step (1), and stir until they are even...
Embodiment 3
[0037] A conductive high-temperature-resistant anti-corrosion chip, the three-layer conductive high-temperature-resistant anti-corrosion coating arranged on the chip all includes the following components in parts by mass: 50 parts of acrylic resin, 25 parts of molecular sieves, 7 parts of asbestos fiber, two 6 parts of manganese oxide, 2.5 parts of copper hydroxide, 6 parts of silicon micropowder, 2 parts of nano-alumina, 1.9 parts of benzimidazole, 1.5 parts of sodium polyacrylate, 30 parts of toluene, 25 parts of ethyl acetate;
[0038] The preparation method of above-mentioned conductive anticorrosion chip coating comprises the steps:
[0039] Step (1): Grinding copper hydroxide and molecular sieves into a fine powder with a particle size of 100-150 mesh;
[0040] Step (2): Add manganese dioxide, silicon micropowder, magnesium sulfate, nano-alumina, and benzimidazole into the mixer, then add copper hydroxide and molecular sieves ground in step (1), and stir until they are e...
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