High-anti-poisoning one-component pouring sealant for LED driving power supply and preparation method of high-anti-poisoning one-component pouring sealant

Abstract

The invention discloses a high-anti-poisoning one-component pouring sealant for an LED driving power supply and a preparation method of the high-anti-poisoning one-component pouring sealant. The pouring sealant is prepared from 100 parts of vinyl polydimethyl siloxane, 100-300 parts of heat conducting fillers, 5-50 parts of a hydrogenous silicon oil crosslinking agent, 0.01-0.5 part of a curing inhibitor and 0.1-5 parts of a platinum complex catalyst. The preparation method comprises the following steps: sequentially adding the raw materials into a stirrer for uniformly mixing, and vacuum-removing air bubbles. The prepared pouring sealant is good in anti-poisoning property, is good in flowing property and operability during use, can fully fill superfine gaps in the LED driving power supply, is high in heat-conducting property and dielectric property after being cured, effectively improves the heat rejection efficiency of heating components of the LED driving power supply, and has good electromagnetic compatibility with the LED driving power supply. The reliability of the LED driving power supply can be improved, and the service life of the LED driving power supply is prolonged.

Description

technical field [0001] The invention relates to the field of potting glue materials, in particular to a highly anti-poisoning single-component potting glue for LED drive power and a preparation method thereof. Background technique [0002] With the rapid growth of the LED lighting industry, LED drive power is developing in the direction of high reliability, high efficiency, long life and environmental protection, so the requirements for potting materials for LED drive power are also increasing. In harsh environments, potting materials should not only prevent the intrusion of moisture and dust, absorb vibration energy, provide protection for sensitive electronic components, but also conduct heat from the components to the outside world. In addition, the dense distribution of components inside the LED drive power supply also requires the potting material to have good enough material compatibility, flame retardancy and dielectric properties, and not to cause adverse electromagn...

AI Technical Summary

Problems solved by technology

[0003] Related potting materials and their preparation methods have been widely disclosed, but none of these potting glues or similar compositions can completely solve the heat dissipation protection problem of the internal components of the LED drive power supply.

For example, in order to improve the thermal conductivity of the potting compound, it is usually necessary to add a large amount of thermally conductive filler, which will affect the dielectric properties of the potting compound and cannot ensure the electromagnetic compatibility between the potting compound and the LED drive power supply.

Rosin, flux residue, acrylic insulating tape, etc. on the highly integrated circuit board inside the LED drive power supply will cause the platinum complex catalyst of the encapsulant to fail and cause the encapsulant to cure slowly or even fail to cure. It is necessary to clean or isolate the circuit board before operation, which affects the production efficiency

Conventional two-component packaging requires special measuring instruments for mixing, which is subject to certain restrictions in use

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