Resin composition used for sealing semiconductor, and semiconductor device with hardening substance of composition

Abstract

The invention provides a resin composition used for sealing a semiconductor, and a semiconductor device with hardening substances of the composition. The objective of the invention is to provide a resin composition, and the resin composition can form a hardening substance. Even though the hardening substance is placed in high temperature of more than 200 DEG C for a long time, thermal decomposition (weight reduction) of the hardening substance is low, and mechanical strength and insulation property of the hardening substance are good under high temperature. The composition comprises: (A) cyanate ester compound which has more than two cyanoethoxy radical in a molecule; (B) inorganic filler; (C) a silicone coupling agent whose tail end contains primary amine, secondary amine, tertiary amine, or a radical represented by -N=CR2 (R is univalent hydrocarbon radical); and (D) at least one compound selected from amines, phenolic compounds, phosphonic compound, and addition product of the phosphonic compound and quinone compound except composition of (C).

Description

technical field [0001] This invention relates to the resin composition for semiconductor sealing. Specifically, it relates to a composition having a small coefficient of thermal expansion, excellent mechanical strength and insulation at high temperature, and excellent long-term thermal stability at high temperature, and a semiconductor device having a cured product of the composition. Background technique [0002] In recent years, semiconductor devices have ushered in remarkable technological innovations. Used in portable information and communication terminals such as smartphones and tablets: for example, through silicon via (TSV) technology that can process large-capacity information at high speed. In this technique, semiconductor elements are first connected in multiple layers, and then flip chip connections are made in an 8-inch or 12-inch silicon interposer. Then, together with the interposer on which a plurality of semiconductor elements connected in multiple layers ...

AI Technical Summary

Problems solved by technology

[0016] However, the heat resistance of the conventional cyanate ester-containing resin composition is insufficient, and if it is left for a long time at a high temperature of 200° C. Or the adhesiveness of the Ag-plated hardened product decreases to cause cracks, etc.

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