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A kind of preparation method of diamond ultra-thin cutting grinding wheel

A technology for cutting grinding wheels and diamonds, which is used in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc. It can solve the problem of difficulty in ensuring powder flatness and uniformity, uneven thickness and size of blanks, and low grinding and thinning efficiency. and other problems, to achieve the effect of realizing batch automatic production, simplifying manual loading and shortening grinding time.

Active Publication Date: 2017-02-08
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal sintered ultra-thin cutting wheels are generally hot-pressed and sintered first, and then the metal-bonded ultra-thin cutting wheels are prepared by plane grinding. Due to the limitation of hot-pressing sintering conditions, diamond ultra-thin cutting wheels cannot be directly sintered to the expected size , the sintering thickness is generally greater than the size of the product, and it is difficult to ensure the smoothness and uniformity of the powder in the mold. The thickness of the blank after sintering is not uniform, and the relative warpage is relatively large (Liu Haifeng. Research on the preparation process: [Master's Dissertation]. Xiamen: Huaqiao University, 2012), so grinding and thinning the diamond ultra-thin cutting wheel blank formed by hot pressing and sintering has become the key to the preparation method
The method of plane grinding is used for thinning. Due to the high hardness and good wear resistance of diamond ultra-thin cutting grinding wheel blanks, the grinding and thinning efficiency is low, and the grinding allowance is large, which directly affects the efficiency of this method for preparing diamond ultra-thin cutting grinding wheels. (He Liang. Research on EDM shaping process of metal bonded ultra-thin cutting wheel: [Master's Dissertation]. Xiamen: Huaqiao University)

Method used

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  • A kind of preparation method of diamond ultra-thin cutting grinding wheel

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Add the required metal powder into the three-dimensional mixer in proportion and mix for 2 to 4 hours, then add pickled 140 to 3000 mesh diamond powder (preferably W40), and continue to mix for 2 to 4 hours to obtain the mixture ;

[0027] (2) Fill the cold-pressing mold with the above-mentioned mixture, fill it evenly, scrape it flat, and carry out cold-pressing under a pressure of 10-25 MPa (preferably 10-20 MPa) to obtain a cold-pressed blank;

[0028] (3) Put the above-mentioned cold-pressed blank into a graphite mold, and carry out vacuum sintering to obtain a sintered blank. The temperature of the above-mentioned vacuum hot-press sintering is 550-950°C, the pressure is 15-60KN, and the heating rate is 20-90°C / min , the holding time is 5-15min, the cooling rate is 20-90°C / min; preferably, the vacuum hot-pressing sintering temperature is 600-900°C, the pressure is 15-50KN, the heating rate is 20-70°C / min, and the heat preservation The time is 5-10 minutes, and ...

Embodiment 2

[0034] Taking a diamond ultra-thin cutting grinding wheel with a thickness of 0.2 mm, an outer diameter of 58 mm, and an inner diameter of 40 mm as an example, W40 diamond is used, and the diamond particle size is 40 μm. The method for preparing the grinding wheel includes the following steps:

[0035](1) According to the following mass ratio, add the required metal powder into the three-dimensional mixer and mix for 2 hours, then add the pickled diamond powder, and continue mixing for 3 hours to obtain the mixture:

[0036]

[0037] The volume fraction of diamond particles is 12.5%;

[0038] (2) Fill the above-mentioned mixture into the cold-pressing mold, fill it evenly, scrape it flat, place it on the operating table of the cold press and press it cold-pressed to obtain a cold-pressed blank of a metal bond diamond thick cutting grinding wheel, with a pressure of 10-15 MPa; Size: inner diameter 40mm, outer diameter 58mm, thickness 30mm;

[0039] (3) Put the above-mention...

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Abstract

The invention discloses a method for manufacturing a diamond ultra-thin abrasive cutting wheel. Capacity-fixed loading is adopted when a thick diamond abrasive cutting wheel blank is manufactured through the method, the loading and striking procedures during single piece sintering are simplified, and the sintering efficiency is improved. A wire cut electrical discharge machining blade is adopted for the method. Compared with an existing sintering manufacturing method, the method has the advantages that the lapping allowance is reduced by 45% to 65%, the grinding time is greatly shortened, and the efficiency for manufacturing the sintering type diamond ultra-thin abrasive cutting wheel is improved. By means of the method, the manual loading and sintering procedures during single piece sintering are simplified, and the diamond ultra-thin abrasive cutting wheel can be conveniently and automatically produced in batches.

Description

technical field [0001] The invention belongs to the field of processing hard and brittle materials, and in particular relates to a preparation method of a diamond ultra-thin cutting grinding wheel. Background technique [0002] Diamond ultra-thin cutting grinding wheel is widely used in blanking, cutting and grooving of hard and brittle materials such as silicon wafers, glass, ceramics and sapphire due to its advantages of high cutting efficiency, good incision quality, and less consumption of cut materials. Hou Changhong. A review of cutting tools for superhard materials used in the electronic information industry. Diamond and Abrasives Engineering, 2010 (01): 60~62). The currently used sintered metal bond diamond ultra-thin cutting grinding wheel has a conventional thickness of about 0.2 mm, has significant advantages such as high bonding strength, good formability, and long service life, and has become an important processing grinding wheel for silicon wafer dicing (Ma Ya...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00B23H7/02B24B1/00
CPCB24D18/0009
Inventor 郭桦徐西鹏张顺林
Owner HUAQIAO UNIVERSITY
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