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Moulding compound based on a partially aromatic copolyamide

A technology of copolyamide and molding compound, applied in the field of polyamide molding compound, can solve the problems of insufficient thermal dimensional stability and the like

Active Publication Date: 2015-03-25
EVONIK OPERATIONS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, their thermal dimensional stability is comparable to that of fully aliphatic polyamides and is far from sufficient for demanding applications

Method used

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  • Moulding compound based on a partially aromatic copolyamide

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0086] AMODEL A-1006: PA6T / 6I / 66 from Solvay Specialty Polymers containing about 65 mol% 6T, about 25 mol% 6I and about 10 mol% 66

preparation Embodiment 2

[0088] Color batch: a mixture of 80% by weight PA12 and 20% by weight carbon black

[0089] TAFMER MH7010: Acid-modified ethylene-butene rubber from Mitsui Chemicals

[0090] EXXELOR VA1803: Acid-modified ethylene-propylene rubber from ExxonMobil Chemical

[0091] Calcium Stearate: Processing Aid

[0092] Polyad PB201 Iodide: Copper-containing stabilizer based on copper iodide and alkali metal halides

[0093] Naugard 445: Oxidation stabilizer (aromatic amine).

[0094] Preparation example 1 (PA6T / 12 60:40; according to the invention):

[0095] 19.118 kg of hexamethylenediamine, 20.898 kg of terephthalic acid, 34.953 kg of ω-aminolauric acid, 32.130 kg of distilled water and 7.46 g of a 50% by weight aqueous solution of hypophosphorous acid were placed in the polycondensation reactor. The starting material was melted at 180°C and stirred at 220°C / 22 bar for 3 hours. With continuous pressure release to 2 bar, the mixture was heated to 300° C. and pressure release was perfo...

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Abstract

A moulding composition, comprising at least 40 wt. % of the following components: a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units: I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and II. 70 to 10 mol % of a lactam and / or of an [omega]-aminocarboxylic acid with 11 or 12 C atoms; and b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units: i) ethene-based monomer units, ii) monomer units based on a 1-alkene with 4 to 8 C atoms, iii) monomer units based on an olefin different from i) and ii), and iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, wherein the sum of the parts by wt. of a) and b) is 100.

Description

technical field [0001] The subject of the present invention is an impact-modified polyamide molding compound which contains partially aromatic copolyamides and polyolefin impact modifiers and which, based on the selection of the individual components, has high impact resistance and elongation at break rate and high heat aging resistance. The molded articles thus produced are also subject-matter of the present invention. Background technique [0002] Known standard polyamides such as PA6 and PA66 can be easily processed and have a high melting point and high thermal dimensional stability, especially if they are reinforced with glass fibers or contain mineral fillers. However, they generally have a high water absorption of up to 10% when stored in water. These aliphatic polyamides cannot be used for many applications which have high demands on dimensional stability even under wet conditions. In addition, by absorbing water, mechanical properties also change; rigidity and st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08L77/06C08L23/26C08L23/08C08L23/16C08K13/04C08K7/14C08K5/098C08G69/36C08G69/26
CPCC08L77/10C08G69/36C08L77/00C08L2205/03C08L2205/02C08L2201/08C08L77/02C08L23/26C08K13/02C08K3/04C08K5/098Y10T428/1352Y10T428/139Y10T428/1393Y10T428/1397C08K5/005C08K5/18C08J5/00C08L77/06C08K3/16C08L2203/18
Inventor J.尼切H.赫格尔S.格尔肯斯F-E.鲍曼R.博伊特
Owner EVONIK OPERATIONS GMBH