Moulding compound based on a partially aromatic copolyamide
A technology of copolyamide and molding compound, applied in the field of polyamide molding compound, can solve the problems of insufficient thermal dimensional stability and the like
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preparation Embodiment 1
[0086] AMODEL A-1006: PA6T / 6I / 66 from Solvay Specialty Polymers containing about 65 mol% 6T, about 25 mol% 6I and about 10 mol% 66
preparation Embodiment 2
[0088] Color batch: a mixture of 80% by weight PA12 and 20% by weight carbon black
[0089] TAFMER MH7010: Acid-modified ethylene-butene rubber from Mitsui Chemicals
[0090] EXXELOR VA1803: Acid-modified ethylene-propylene rubber from ExxonMobil Chemical
[0091] Calcium Stearate: Processing Aid
[0092] Polyad PB201 Iodide: Copper-containing stabilizer based on copper iodide and alkali metal halides
[0093] Naugard 445: Oxidation stabilizer (aromatic amine).
[0094] Preparation example 1 (PA6T / 12 60:40; according to the invention):
[0095] 19.118 kg of hexamethylenediamine, 20.898 kg of terephthalic acid, 34.953 kg of ω-aminolauric acid, 32.130 kg of distilled water and 7.46 g of a 50% by weight aqueous solution of hypophosphorous acid were placed in the polycondensation reactor. The starting material was melted at 180°C and stirred at 220°C / 22 bar for 3 hours. With continuous pressure release to 2 bar, the mixture was heated to 300° C. and pressure release was perfo...
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