High-viscosity mortar cutting process for cutting silicon chip

A silicon wafer cutting and cutting process technology, applied in the direction of fine working devices, working accessories, manufacturing tools, etc., can solve the problems that the viscosity of mortar can no longer be improved, the line marks, and the processing efficiency cannot be improved, so as to achieve the improvement of silicon The effect of increasing sheet cutting ability, reducing loss, and reducing processing cost

Inactive Publication Date: 2015-04-08
YANGGUANG GUIFENG ELECTRONICS SCI & TECH CO LTD
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Problems solved by technology

Therefore, the viscosity of the mortar cannot be increased, the processing efficiency cannot

Method used

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  • High-viscosity mortar cutting process for cutting silicon chip
  • High-viscosity mortar cutting process for cutting silicon chip

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Embodiment Construction

[0027] The following will combine figure 1 , figure 2 The present invention is described in further detail with specific examples.

[0028] A high-viscosity mortar cutting process for cutting silicon wafers, the specific steps are as follows:

[0029] a. Use cutting fluid with a viscosity of 60-65mPa.s and green silicon carbide sand to prepare a density of 1.48±0.02g / cm 3 , mortar with a viscosity of 150±10mPa.s and constantly stirred to prevent precipitation;

[0030] b. Separate the high-density mortar and low-density mortar from the above-mentioned mortar through a centrifugal screw separator, and stir to prevent sedimentation; among them, the high-density mortar has a density of 1.68g / cm 3 , the viscosity is 280±10mPa.s, and the density of low-density mortar is 1.35g / cm 3 , the viscosity is 100±10mPa.s;

[0031] c. Send the high-density mortar separated in step b to the mortar nozzle, and then spray it onto the steel wire mesh for cutting through the mortar nozzle fo...

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Abstract

The invention discloses a high-viscosity mortar cutting process for cutting a silicon chip and belongs to the technical field of cutting of a solar cell silicon chip. The high-viscosity mortar cutting process comprises the following steps: a, preparing mortar by adopting cutting fluid and green silicon carbide sand particles and continuously stirring to prevent sedimentation; b, separating high-density mortar and low-density mortar out of the mortar by a centrifugal separator and continuously stirring the separated high-density mortar and low-density mortar to prevent sedimentation; c, feeding the high-density mortar into a cutting seam to participate in cutting for single crystal cutting and using the low-density mortar for jetting chips in a knife edge after cutting so as to solve the problem of an adhesion phenomenon; d, recovering the high-density mortar and the low-density mortar which are used in the step c together and feeding the recovered high-density mortar and low-density mortar into centrifugal separator again for repeated use. According to the high-viscosity mortar cutting process, high-viscosity mortar can be used in the cutting of the silicon chip so as to promote cutting capacity of the silicon chip and improve a finished product ratio of products and working efficiency.

Description

technical field [0001] The invention relates to the technical field of solar cell silicon wafer cutting. Background technique [0002] Silicon wafer cutting is the process of manufacturing solar photovoltaic cell substrates. At present, the mortar multi-wire cutting process is mainly used, and the steel wire mesh carries the mortar to cut single crystal or polycrystalline silicon rods into many thin slices. The main purpose of the mortar is to bring the abrasive sand into the cutting seam to participate in the cutting. [0003] The mortar is composed of cutting fluid and wear-resistant sand particles. The cutting fluid is generally made of polyethylene glycol (PEG) base or oil base with good wettability, strong removal ability and excellent dispersion characteristics for silicon carbide abrasives. compound. Generally, PEG with a molecular weight of 300-500 and a viscosity of 30-55mPa.s is used in photovoltaic slices. Due to the different cutting processes, the selected vis...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00B04B13/00
CPCB04B13/00B28D5/007B28D5/045
Inventor 荆新杰范玉红李佩剑范同康李文辉樊入涛周为贞白计强
Owner YANGGUANG GUIFENG ELECTRONICS SCI & TECH CO LTD
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